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Show off your lidless CPU
- Thread starter Enjoicube
- Start date
- Joined
- Nov 2, 2004
- Messages
- 742
It's not exactly brain surgery. You need a razor blade and a clean work space. The razor blade cuts the rubber seal around the IHS and (with some patience and careful work) then voila lidless CPU. The hard part is not cutting off the resistors and being mindful of the pins (not bending/breaking them).Kermit said:
I've done it successfully before on other chips (Venice and some Intel chips), but all of my SD-core chips didn't like it (oddly enough).
I've trashed enough chips that I wont risk going lidless anymore.
- Joined
- Mar 5, 2004
- Messages
- 538
In addition to everyone showing off their lidless CPU, could they also list how they are cooling it and what modifications they did to help it seat properly and without crushing the core.
Maybe this topic could eventually make it to the Overclocking/Cooling section as a guide to
1) How to take your top off without destroying it
2) How to cool your lidless CPU without destroying it
3) List of Cooling Results with/without lid
I think this link has been referred to before but it has some heatsink discussion as well as some instructions/pics of how to remove the lid.
http://www.xtremesystems.org/forums/showthread.php?t=59068&page=16&pp=25
Some people modified the heatsink, some didn't, some recommend say the xp-90 and 120, some say avoid.
I have an Alpha 8150 but have to get a new backplate as the one on my DFI SLI-D is not the standard AMD one and the screws are not long enough thread into the backplate.
EDIT: I bought some screws and washers and was able to use the original DFI backplate and the 8150 adjusted to make contact with the core. Using a 32 CFM (2810 RPM) fan on low rpm of 1200 (silent), I get 35 C Idle/45-47 C Load on an X2 4800 at 1.4 V, Stock 2.4 GHz. With the fan at full speed, I get 32 C Idle/43-45 C Load
Would the unlidded core be able to handle the same pressure as with the IHS on? I would think it would be the same at the AthlonXP. The mobile A64 (DTR) is bare. Are there any pressure mounting specs on it?
If using a spring mounted HSF (coil or spring of the XP-90/120) or waterblock, if the springs still were compressed when contacting the core without the IHS, then would that be too much pressure? Given that the Spring Force on the IHS would be F=k*Delta (x) and the thickness of the IHS (from the link) is about 0.094 inches (correct me on this if it's wrong), then the force on the core without the IHS would be basically the same as with the IHS since the difference in the thickness and spring compression difference due to the IHS is so small.
Since force is basically the same and the surface area of the core is less than the IHS (which is touching the core and edges of the processor for distributing the pressure), then the pressure on the unlidded core would be more that with the IHS.
Also, here's a good point on height of the core and the plastic CAM height:
http://www.overclockers.com/tips1197/
I used the DFI original mounting bracket balance on its long edge to verify if the core was higher than the plastic CAM where the lever attaches to lock the core down. The above link mentions different manufacturers may have CAMS of differing heights. It's hard to tell by eye especially since the socket is more in the middle of the board than near the edge on so many boards now.
Maybe this topic could eventually make it to the Overclocking/Cooling section as a guide to
1) How to take your top off without destroying it
2) How to cool your lidless CPU without destroying it
3) List of Cooling Results with/without lid
I think this link has been referred to before but it has some heatsink discussion as well as some instructions/pics of how to remove the lid.
http://www.xtremesystems.org/forums/showthread.php?t=59068&page=16&pp=25
Some people modified the heatsink, some didn't, some recommend say the xp-90 and 120, some say avoid.
I have an Alpha 8150 but have to get a new backplate as the one on my DFI SLI-D is not the standard AMD one and the screws are not long enough thread into the backplate.
EDIT: I bought some screws and washers and was able to use the original DFI backplate and the 8150 adjusted to make contact with the core. Using a 32 CFM (2810 RPM) fan on low rpm of 1200 (silent), I get 35 C Idle/45-47 C Load on an X2 4800 at 1.4 V, Stock 2.4 GHz. With the fan at full speed, I get 32 C Idle/43-45 C Load
Would the unlidded core be able to handle the same pressure as with the IHS on? I would think it would be the same at the AthlonXP. The mobile A64 (DTR) is bare. Are there any pressure mounting specs on it?
If using a spring mounted HSF (coil or spring of the XP-90/120) or waterblock, if the springs still were compressed when contacting the core without the IHS, then would that be too much pressure? Given that the Spring Force on the IHS would be F=k*Delta (x) and the thickness of the IHS (from the link) is about 0.094 inches (correct me on this if it's wrong), then the force on the core without the IHS would be basically the same as with the IHS since the difference in the thickness and spring compression difference due to the IHS is so small.
Since force is basically the same and the surface area of the core is less than the IHS (which is touching the core and edges of the processor for distributing the pressure), then the pressure on the unlidded core would be more that with the IHS.
Also, here's a good point on height of the core and the plastic CAM height:
http://www.overclockers.com/tips1197/
I used the DFI original mounting bracket balance on its long edge to verify if the core was higher than the plastic CAM where the lever attaches to lock the core down. The above link mentions different manufacturers may have CAMS of differing heights. It's hard to tell by eye especially since the socket is more in the middle of the board than near the edge on so many boards now.