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Leaked AMD Ryzen Benchmarks?

Simplyfun said:
The thing about marketing is that Leynar doesn't have to actually exist. If it seems that a leak sprouted out of nowhere AMD can shrug their shoulders when asked by folks like Kyle and say "out of our control" even when it costs him hits.
Click to expand...
That's true. I'm glad I don't work in marketing.

I'll definitely be reading the [H] review tomorrow as well as the ones from Anandtech (if they actually have a review up in a timely manner), PCPer, etc., even though I've seen all these leaks lately. I want something official!
 
Schmave said:
I want something official!
Click to expand...

Don't we all?

I just have tempered expectations, I don't expect a hands down win personally, I just want to see something sound that can be built on to carry the company forward. If they hit a reasonable IPC at a competitive price point, fantastic. That bodes well for the future, a future that will mostly be constructed on APU's , not these enthusiast chips that rely on discrete GPUs.

As much fun as they will be, they're not the profit center that ensures more improvements going forward.
 
razor1 said:
Now lets get into phase changes, do you know why its worse to get burned by 100 c of water vapor than putting your hand on 100 c metal plate?
Click to expand...

Lol, did you just finish your introductory chemistry class or something? :pompous:

Specific heat matters, but it's a ratio of heat capacity to mass. The ability of a heatsink to move heat away from a source doesn't just depend on the specific heat of the substance. It matters, but so does the amount of that substance.

However we seem rather off topic and I don't want it to come across as a pissing match, so if you want to continue our conversation about this matter I'd welcome a private message, but
 
sover said:
Lol, did you just finish your introductory chemistry class or something? :pompous:

Specific heat matters, but it's a ratio of heat capacity to mass. The ability of a heatsink to move heat away from a source doesn't just depend on the specific heat of the substance. It matters, but so does the amount of that substance.

However we seem rather off topic and I don't want it to come across as a pissing match, so if you want to continue our conversation about this matter I'd welcome a private message, but
Click to expand...


heat to mass means jake, as long as you can move that heat away from the piece that is creating the heat.

And no wrong class man, chemistry only part of that......

This is why cooling elements doesn't matter how "strong" they look, the only reason they are heavy or have more mass is because they need it to support themselves and fins which are needed to remove the heat from the unit.

But what you keep posting here, so guess what? BUT........

I suggest you look up 3m novec, those are the things my friend and I have worked with so I know what I'm talking about. If you have money to spend on oh 400 bucks per gallon, I suggest you try it.
 
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razor1 said:
heat to mass means jake, as long as you can move that heat away from the piece that is creating the heat.

And no wrong class man, chemistry only part of that......

This is why cooling elements doesn't matter how "strong" they look, the only reason they are heavy or have more mass is because they need it to support themselves and fins which are needed to remove the heat from the unit.

But what you keep posting here, so guess what? BUT........

I suggest you look up 3m novec, those are the things my friend and I have worked with so I know what I'm talking about. If you have money to spend on oh 400 bucks per gallon, I suggest you try it.
Click to expand...

Someone tell Razor to get on the phone with Coolermaster, because apparently they can save 40% of their materials expenditures for their Hyper 212 EVO while getting the same cooling performance!

They've been wasting all that aluminum and copper for years!

/s
 
Pieter3dnow said:
No one has ever accused Jay to be the sharpest tool in the shed ;) .
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Not sure why people are insulting Jay over this, especially on /r/amd. If say, AMD is pushing out BIOS updates for better memory, then reviewers gotta work extra hard to finish before NDA. Jay states his vid will be late, but luckily major youtubers usually dont seem to suffer being late too much. Other review sites might suffer less views for being late. Speaking of updates, aside from the memory speed increases, anyone have any thoughts on what AMD keeps pushing out that changes stuff significantly?
 
SighTurtle said:
Not sure why people are insulting Jay over this, especially on /r/amd. If say, AMD is pushing out BIOS updates for better memory, then reviewers gotta work extra hard to finish before NDA. Jay states his vid will be late, but luckily major youtubers usually dont seem to suffer being late too much. Other review sites might suffer less views for being late. Speaking of updates, aside from the memory speed increases, anyone have any thoughts on what AMD keeps pushing out that changes stuff significantly?
Click to expand...


This happens regularly on new hardware launches, its too be expected, just very irritating for reviewers cause the work they have already done might have to be thrown out. And with looming deadlines trying to get it done at the time the NDA is lifted, pretty sure Jay is just irritated.
 
SighTurtle said:
Not sure why people are insulting Jay over this, especially on /r/amd. If say, AMD is pushing out BIOS updates for better memory, then reviewers gotta work extra hard to finish before NDA. Jay states his vid will be late, but luckily major youtubers usually dont seem to suffer being late too much. Other review sites might suffer less views for being late. Speaking of updates, aside from the memory speed increases, anyone have any thoughts on what AMD keeps pushing out that changes stuff significantly?
Click to expand...

I would say that it has everything to do with the fixes they applied to "Zen" back when the announcements came in of it shipping in Q1 of 2017 last year.
The reason why they only had one demo machine running something trivial, there are things they are figuring out. If this was not the case Ryzen would have shipped a lot earlier.

There were some other rumours about chipsets and motherboards problems. I am not sure where the problem lies exactly between motherboard or cpu or both.

It would be nice if they kept those benchmark numbers available to see how much this actually did fix.
 
razor1 said:
https://videocardz.com/66745/amd-ryzen-7-press-deck-leaked

Full press deck

Just to point out overclocking lol

R7 1800X all core boost 3,7 GHz, XFR single core 4,1 GHz (slide 10)

XFR Single core!
Click to expand...

I have been for months suggesting that XFR is single core because the only temperature dependent frequency in RyZen, F_TMAX, is a single-core boost. All the other frequencies in Ryzen are predefined and don't depend on temperature. Therefore for the R7-1800X the frequencies are:

F_P0 = 3.6GHz (base clock)

F_TMT = 3.7GHz (all-core turbo)

F_TST = 4.0GHz (single-core turbo)

F_TMAX = 4.1GHz (single-core XFR turbo, limited to 4.1GHz with stock cooler and higher with better cooling I assume).


razor1 said:
Highlighted in orangish and red.
Yes we do

ZD nomenclature of AMD parts are not ES's, those are qualification parts. Qualification parts are final release products, and if you want to look this up please look at Intel's in dpeth documentation on how qualification is done, and how motherboard manufactures are brought into the process early on. AMD as something similar. If you are so bold just call up Intel and AMD and purchase them as well, you will need to buy them in lots.



So you are saying pc per and tech power up don't know what the nomenclature of the serial numbers are? This is the same thing Juanrga stated, so take it or call BS on everyone that seems to know what the ZD stands for.
Click to expand...

First letters in the ID string:

1 = First gen engineering sample
2 = Second gen engineering sample
Z = Qualification sample (= retail sample for technical pruposes)

One can also check the last pair of digits on the ID string:

E4 = A-grade silicon (<-- non-final silicon used in engineering samples)
F4 = B-grade silicon (<-- final silicon used in qualification samples and retail chips).

The chip used in the review was

IMG_0335.jpg


The decodification is

Z = Qualification sample
D = Destop
340 = Base frequency
6 = Model revision number
BA = 95W
M = AM4 socket
8 = number of cores
8 = 4MB L2 + 16MB L3
F4 = B-grade silicon

Therefore this is the QS for a R7 1700X chip.
 
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SighTurtle said:
Not sure why people are insulting Jay over this, especially on /r/amd. If say, AMD is pushing out BIOS updates for better memory, then reviewers gotta work extra hard to finish before NDA. Jay states his vid will be late, but luckily major youtubers usually dont seem to suffer being late too much. Other review sites might suffer less views for being late. Speaking of updates, aside from the memory speed increases, anyone have any thoughts on what AMD keeps pushing out that changes stuff significantly?
Click to expand...

My RoC source says AMD have been working around the clock to iron out kinks with firmware, the obviously want Ryzen benched in fair circumstances

He tested yesterday on a kit of enthusiast 3200C14-14-14 kit and the results were.......dayum
 
Ch
juanrga said:
I have been for months suggesting that XFR is single core because the only temperature dependent frequency in RyZen, F_TMAX, is a single-core boost. All the other frequencies in Ryzen are predefined and don't depend on temperature. Therefore for the R7-1800X the frequencies are:

F_P0 = 3.6GHz (base clock)

F_TMT = 3.7GHz (all-core turbo)

F_TST = 4.0GHz (single-core turbo)

F_TMAX = 4.1GHz (single-core XFR turbo, limited to 4.1GHz with stock cooler and higher with better cooling I assume).




First pair of letters in the ID string:

1D = First gen engineering sample
2D = Second gen engineering sample
ZD = Qualification sample (= retail sample for technical pruposes)

One can also check the last pair of digits on the ID string:

E4 = A-grade silicon (<-- non-final silicon used in engineering samples)
F4 = B-grade silicon (<-- final silicon used in qualification samples and retail chips).

The chip used in the review was

IMG_0335.jpg


The decodification is

ZD = Qualification sample
340 = Base frequency
6 = Model revision number
BA = 95W
M = AM4 socket
8 = number of cores
8 = 4MB L2 + 16MB L3
F4 = B-grade silicon

Therefore this is the QS for a R7 1700X chip.
Click to expand...

Chips limited by bios, if they literally don't have a 28/2 press board they have a gimped bios
 
OrangeKhrush said:
Ch


Chips limited by bios, if they literally don't have a 28/2 press board they have a gimped bios
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Shit 2/28? I think they got some 3/1 too.

I'm almost glad I am not going be able to touch this stuff till at least Sunday, because there'll be 3 BIOS fixes by then at this rate.
 
I believe well known poster in overclocker forums that AMD would be updating the firmware to support faster memory and improve memory performance as alot of it is locked up and can't be edited right now. May be they have been working hard around the clock on such a thing. He did say AMD was still tweaking it and there is alot of room left for improvement. So this might be it, lol.
 
NKD said:
I believe well known poster in overclocker forums that AMD would be updating the firmware to support faster memory and improve memory performance as alot of it is locked up and can't be edited right now. May be they have been working hard around the clock on such a thing. He did say AMD was still tweaking it and there is alot of room left for improvement. So this might be it, lol.
Click to expand...

Therefore the several leaks showing abnormally low memory scores were just reporting how the systems behave before this supposed last minute fix.
 
juanrga said:
Therefore the several leaks showing abnormally low memory scores were just reporting how the systems behave before this supposed last minute fix.
Click to expand...

yes, from my personal knowledge bios behaviour has been tweaked significantly but still AMD are running new firmware updates like crazy, like this is a formula one testing session.
 
OrangeKhrush said:
yes, from my personal knowledge bios behaviour has been tweaked significantly but still AMD are running new firmware updates like crazy, like this is a formula one testing session.
Click to expand...

Why do people in general find this weird? I mean your new product is about to ship and you will do everything to make sure you get the best performance out of it. Why does this not sound plausible to some people ?
 
Magic Hate Ball said:
Shit 2/28? I think they got some 3/1 too.

I'm almost glad I am not going be able to touch this stuff till at least Sunday, because there'll be 3 BIOS fixes by then at this rate.
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The chips will work just fine as is I think they've ensured a "this works" thing, but I doubt they've left everything on the table.

A.\ They've held back performance intentionally to control the news, Lisa seems to understand media and Internet or hired someone who does.
B.\ They've actually had issues and are fixing them, for us.

Neither is wrong.
 
It has been mentioned in the past but I cannot remember, anyone know which chipset AMD 3rd partied for Ryzen?
Thanks
 
CSI_PC said:
I asked which chipset as I could not remember :)
Anyway found the answer, was the Southbridge.

Thanks
Click to expand...

There is only one chipset that's segmented into X370/B350/A320/X300 etc. And its not a south bridge either. Its a PCH or FCH.
 
CB15 ST score at 148 is locked at 3.7Ghz score, already confirmed at 4Ghz ST can be anywhere from 160-163 depending on setup.

Maybe another balked BIOS board, as expected from aftermarket products.
 
Shintai said:
There is only one chipset that's segmented into X370/B350/A320/X300 etc. And its not a south bridge either. Its a PCH or FCH.
Click to expand...
I know but they were contracted to develop the Southbridge portion, its operation is similar enough even if it is onboard.
Your arguing semantics when I am putting into context of what most of us can relate to it with regards to Intel.
Cheers
 
CSI_PC said:
I know but they were contracted to develop the Southbridge portion, its operation is similar enough even if it is onboard.
Your arguing semantics when I am putting into context of what most of us can relate to it with regards to Intel.
Cheers
Click to expand...

Then its called a PCH and have been done so for ages :)
 
Shintai said:
Then its called a PCH and have been done so for ages :)
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Sigh.
So Intel has no Southbridge for USB/SATA/PCIe?
I suppose you want us to ignore Southbridge and use PCH and ICH, yeah sounds much clearer for all and yet Intel or journalists reference the Southbridge for those functions (which is in essense the aspect ASMedia seems to have done on Ryzen controller).
 
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