Megalith
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- Aug 20, 2006
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In a presentation slide, Intel alleges that AMD’s EPYC server processors are actually repurposed desktop products comprising parts that have merely been “glued together.” They claim that this design results in “inconsistent performance” and additionally accuse AMD of having a poor track record and being an inconsistent supplier.
Ah, the "glued-together" dies. Let's forget how AMD's Zen cores actually look like they were architected from the get-go for modularity and scaling, which has allowed the company to keep die-sizes to a minimum and yields to a maximum. This means that from a same-sized wafer, AMD can make more Ryzen/EPYC processors (because yes, that's the beauty of it, they're almost interchangeable), and in all likelihood, have more of those full-fledged dies without any defects that affect yields.
Ah, the "glued-together" dies. Let's forget how AMD's Zen cores actually look like they were architected from the get-go for modularity and scaling, which has allowed the company to keep die-sizes to a minimum and yields to a maximum. This means that from a same-sized wafer, AMD can make more Ryzen/EPYC processors (because yes, that's the beauty of it, they're almost interchangeable), and in all likelihood, have more of those full-fledged dies without any defects that affect yields.