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If this bullshit continues with Haswell I'm going to buy AMD. Congrats on fixing Intel's retarded change.
Right there with you. I was so pissed that I waited around for IB. In the end I went ahead and bought a 2500K. It is always funny to me what lengths people will go to to make themselves feel really good about something that they want to feel good about even if it doesn't deserve it. I mean, I know some of it is just tinkering - hardware aficionados tend to like to tinker - but having to take the lid off is just sad. Intel stunk up the joint with the TIM rather than solder decision.
DeLid or suffer the heat. :toast:
Delidding is in the air. I can't wait no more. *I'm running a 20 pass LinX stress test right now for my before delid test information. *In a few minutes I'm going to delid my 3570k. *
I wouldn't do this unless I was confident that I can do this and that my 3570k will benefit from it.
Right now my water cooled rig only has 1x120mm HWLABS Black ICE GTX Stealth radiator.
This is the testing water loop configuration for my first De-lidding test.
I have another radiator on back order at FrozenCPU and wanted to wait for it but I couldn't wait no more.
Photos from my adventure.
Officially Delidded. *No going back at this point in the game.
Cleaned up and ready to GO!
Contact Paper pressure test is a go!
Here is contact paper pressure test with my DT SNIPER water block on 3570k IHS and then 3570k direct die.
With IHS.
No IHS direct DIE! :rockout:
Before Delidding.
Ambient Temp 26C
TIM IC Diamond 24
Temps under LinX load 83C 93C 89C 84C
http://valid.canardpc.com/show_oc.php?id=2531026
De-Lidded results.
Direct DIE Contact
Ambient Temps 25.5C
TIM IC Diamond 24
Temps under LinX load *70C 80C 78C 74C
http://valid.canardpc.com/show_oc.php?id=2531139
Conclusion: By de-lidding my IB i5-3570k I was able to lower average core temps from 87.25C to 75.5C!!!!!
Intel left it to us to effectively cool IB. This works!!
Share your methods, lessons learned, and temps.
Glad to see you joined the club Good Sir! I have just gotten Win7 reinstalled, and my early testing with the hot ass GTX480 in my loop is still wonderful! At 4.5Ghz I have been seeing temps about 12-15C below yours, but I am in a cool room..My goal is to head to 4.9+, considering the thermal head room..
Also, I would HIGHLY suggest you stay with the IC Diamond since you are running direct die mount like I am.. IC does have a break in period, they clear say so..I saw my temps drop a bit after a 24 hr stress test..The metal pastes MIGHT give you 1-3C lower temps, but the chances of them running due to thermal pump out turns the idea off for me..I am not willing to risk $1000 in hardware for a few degrees to be honest..
There is a long thread over at Anandtech started by IdontCare that has some great information...I would really appreciate you posting your data over there..What we have been seeing with normal TIM compounds is that guys are getting great results like ours, but after 2~4 weeks, they are sky rocketing back to the stock TIM levels..Keep in mind it only appears to happen to the guys that are reusing the IHS, where we are not, but some long term data from us would help a lot of other users..
Would you be willing to run 10-15 passes with IBT(make sure you have the latest binary packs installed) under "Xtreme Mode"? If you aren't familiar with Xtreme Mode, you simply right click on the Start button that would normally start the IBT test..I want to see what your temps look like under that mode..I will do the same and report back with some screenshots as well...
I'd like to that right now but I am not sure if I have the latest binary updates. If you could post instructions on how to update the binaries or to a flavor of IBT or LINX with the updates I'd appreciate it.
I will do the test and post temps with the IBT flavor that I have soon.
Don't worry about replacing the binary..As long as you are using IBT v2.54 that was updated in July of 2012 then we are able to apples to apples..
What do you guys think of these temps? I am blown away!!
I have IBT v2.54.
I think you your temps are great but your Gflops are much lower than mine...
My voltage is set higher than yours but I think I can go lower on the voltage to possibly match yours. Not sure. My ram is at CL10 2400mhz and that could explain the higher Glflop and IB IMC heating up more.
I believe the ram speed is the reason for your Gflops being higher..I am running 16GB of G.Skill DDR 2133, but it is currently only running @ 1600mhz with relaxed timings (im talking CAS 11), since I wanted to isolate the ram from being another variable when stress testing..Are you running your ram timing @ 1T, or 2T? Im curious if timing makes a difference with IB..running @ 1T was much better on 1366, especially when Folding..
I haven't delidded at all and using an air cooler. I don't think my temps are much higher than either of yours. But I am not sure if I can run 4.5 at 1.128v either. I think I am more around 1.18v but I will give it a try tonight if I get a chance. I will also see if I can get away with the lower voltage you guys are using with IBT. I have been finding to pass prime I need to jack the voltage higher than it needs to pass IBT. I will use extreme and 2.54. Unfortunately I still am not sure how to post screen shots because you guys do it from the web? somehow. Is there a way I can just grab these shots from my hard drive and post them?
I just burned at maximum with xtreme stress checked at 4.5GHz in diagnostic mode at 1.154v on load. LLC was @ 2 and 1.165v bios using 7317MB of ram.
Temps were 60-64-64-62 during the 3rd pass where I shut it down because I don't run that setting anyway. The reason I compared this was not to negate your de-lidding results or to say "hey my chip is better thermally". What I am trying to figure out is whether I would need to de-lid to see any effect from going to water. I have seen a review where the RASA kit beat a D14 by 15 or 20 degrees on a heavily overclocked CPU.
http://www.overclock3d.net/reviews/cases_cooling/xspc_rasa_750_rs360_watercooling_kit_review/1
Now obviously I have "some" thermal transfer going down if I am getting "similar" temps than you guys that are bare die and on water.. I even made a thread about this in the cooling section. Do you think I could see a benefit without de-lidding. I mean there is NO WAY in my mind that my chip is at 65 degrees during xtreme IBT at 4.5 unless it were transferring heat readily.
I just burned at maximum with xtreme stress checked at 4.5GHz in diagnostic mode at 1.154v on load. LLC was @ 2 and 1.165v bios using 7317MB of ram.
Temps were 60-64-64-62 during the 3rd pass where I shut it down because I don't run that setting anyway. The reason I compared this was not to negate your de-lidding results or to say "hey my chip is better thermally". What I am trying to figure out is whether I would need to de-lid to see any effect from going to water. I have seen a review where the RASA kit beat a D14 by 15 or 20 degrees on a heavily overclocked CPU.
Now obviously I have "some" thermal transfer going down if I am getting "similar" temps than you guys that are bare die and on water.. I even made a thread about this in the cooling section. Do you think I could see a benefit without de-lidding. I mean there is NO WAY in my mind that my chip is at 65 degrees during xtreme IBT at 4.5 unless it were transferring heat readily.
This poll makes it look like only a 53% success rate on delidding.
I seriously doubt it. Probably just people voting to lower sucess rate.
grats! Now go play some games finally
Ok I don't quite understand something. Once you've removed the lid and cleaned it all up, are you inserting the cpu back into the motherboard without the lid? Does the clamp close properly without it? Will it damage it? Will a heat sink attach properly without it?
Or, if you are keeping the lid on, but as I surmise from the photos putting in your own thermal compound, is the compound enough to keep the lid in place properly to clamp it down?
I'm not understanding though how the cpu will stay in place. All of my builds have the motherboard vertical, plus I use some rather heavy heat sinks...Antec Kuhler for example. It'll pull that cpu right out of the socket without any problem.
I'm not understanding though how the cpu will stay in place. All of my builds have the motherboard vertical, plus I use some rather heavy heat sinks...Antec Kuhler for example. It'll pull that cpu right out of the socket without any problem.
I'm not understanding though how the cpu will stay in place. All of my builds have the motherboard vertical, plus I use some rather heavy heat sinks...Antec Kuhler for example. It'll pull that cpu right out of the socket without any problem.
Coolers like the one you're speaking of usually have relatively strong back plates that will secure the bare IHS-less CPU to the cooler itself.
I went with a EK-LGA115X TRUE Backplate with my Mpower Z77 MB and it works well with my DT SNIPER water block.
From the front before securing the DT SNIPER water block.
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grats! Now go play some games finally I am getting my second card hopefully next week. If I can get about 99% usage on them both at whatever game I am playing at the time then I will probably scale back to 4.5 as well. I like that nice low voltage and temp. Gaming under 50 degrees C is definitely good for the longevity of your chip. Then I will begin saving my next $200 and I will de-lid then. If successful I will use that $200 for a xspc kit. If not another chip.
SonDa5,
I am glad you posted that picture, because I think you used WAY too much IC Diamond..I have found that applying a small amount on the die, then heating it with a high powered hair dryer to make it soft is the best way..Once heated, the IC Diamond is as easy to spread as any other TIM...I used a credit card to spread a nice thin layer across the die...
I ran 15 passes under Xtreme Mode with all Ram and temps were the same, but I forgot to get a screenshot..I have been able to boot into Windows @ 4.9Ghz, and even run 10 passes under "Standard Mode". but it requires 1.32V, and while 3 of the cores were in the upper 70's, one spiked to 85C for some reason..