Der8auer Delids a W-3175x

AlphaAtlas

[H]ard|Gawd
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Prolific overclocker der8auer got his hands on an Intel W-3175x before yesterday's official launch, and delidded it for the world to see. The YouTuber mentions that he didn't even know the platform's price tag at the time, but was fairly certain it was the most expensive CPU he ever delidded. He also notes that, unlike the previous HEDT platforms, the LGA 3467 socket doesn't have an Independent Loading Mechanism, and that installing the CPU and heatsink is a pain in general, hence he was only able to get 4 out of 6 memory channels working.

Check out the video here, or skip to 8:49 if you just want to see a naked W-3175x.
 

JargonGR

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Solder is not what it used to be anymore....all new 9XXX 2066 CPUs (& 9900K) perform worse thermally than a delidded CPU with Liquid metal...but better than thermal poo + IHS.
Like it or not solder is thick and less than ideal..It's time to start offering bare die CPUs with some protective frames around them.
 
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Solder is not what it used to be anymore....all new 9XXX 2066 CPUs (& 9900K) perform worse thermally than a delidded CPU with Liquid metal...but better than thermal poo + IHS.
Like it or not solder is thick and less than ideal..It's time to start offering bare die CPUs with some protective frames around them.

I though that was because the 9900k had a thicker die?
 

BrainEater

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ILM is the spring clamp?

With a normal retention mechanism , you place the chip in the socket,then clamp it down with the latching cover......the heatsink is then mounted after.
The socket 3647 chips are not like that.
The cpu clips to the heatsink with a plastic retainer, then the whole thing is clamped down to the socket......the HSF assembly provides alignment.

I just put waterblocks onto my dual Xeon 6144's.......pain in the ass is an understatement.
It's sketch city when you are using aftermarket coolers without that retainer/alignment clip....not easy.
 

JargonGR

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Dolby Atmos is so stupid, just tilt your speakers upwards and viola, you've got ghetto Atmos.

I though that was because the 9900k had a thicker die?

The 9900K is yet another CPU that also does better delidded + LM but especially for the big dies (9900X-9980X) the situation is worse since you can't delid them easily now without causing damage. The Skylake-X refresh has better stock clocks and possible a more mature process and/or better yields but it is a fact that SOLDER + IHS is not perfect. You still have two extra thermal layers between the cooler and the die which no matter what will always be worse than straight dies to the bottom of the heatsink.

Now in theory it is easier said than done since there are reports of dies that are not 100% flat (do not know why) so trying to achieve perfect contact between a bare dies and a cooler might prove to be a chore....especially with liquid metal that needs special care and a possible 2nd application before it stabilizes for long term use (for pure copper heat sinks its almost certain).

Anyway, I had the chance to read a lot about this because I am planning to try my luck in direct die cooling and there seems to be no easy way around it with regards to success...mostly due to uneven dies and waterblocks along with LM not being stable enough if you use more than a tiny thin layer.
 
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