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the info is incorrect, he did not rip the die off, he used heat gun and accidentally de-solder the SMD capacitor, the die is fully functional and survived.
everyone i ve seen delid cleans the top of paste.... kinda weird....
It's solder, not paste.
When Sandy went to Ivy and then the new architecture of Haswell, most of the empty space from the shrinkage went to on die GPU. Since Ivy-E has even more dead silicon and empty space compared to Sandy-E, hopefully it will over clock better than either Sandy-E or Ivy.
First thing I said to myself is, " Hey that looks just like the old un-lidded Thunderbird/Durons I used to play with".
Once or twice I even cracked a core ever so micro an amount. Dead.
In china, that's a half year's salary down the toilet.
Sandybridge-E uses solder instead of thermal paste so there would be little advantage to delidding. The regular Ivybridge and Haswell CPUs use thermal paste between the die and the heat spreader, which leads to increased temperatures (sometimes quite a bit so). That's why they were delidding this - to see how Intel joined the heat spreader and the die. It appears to be solder and that is good news.This makes sense; the pic looks like a solder blob.
It looks like the way to remove it is to cut around the edges with tungsten wire, and then use a heat gun.
I'm running 4.7GHZ on my i7-3930; it hits 60C in euler3d on the 6 pipe heatsink I've got on it.
I can't see going to the extra hassle, personally...
I disagree. I'd rather have solder and not have to worry about delidding to get acceptable performance.That guy kicks ass. Hope Intel doesn't use solder on that chip shen it is released. Bare die access for cooling pleasure is a gift.
I disagree. I'd rather have solder and not have to worry about delidding to get acceptable performance.