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Yes, I have my hands shaved at the same time I get my taint done.Kyle you gotta do more videos, they are always good to watch. On a side note do you shave your hands? ^.^
Kyle you gotta do more videos, they are always good to watch. On a side note do you shave your hands? ^.^
LOL! I hear you brother. I will say this, most of the folks that go into "this business" to get free hardware, and there were plenty, are mostly gone now.Well of course you did, it's your profession. This is a work related expense, thus it's fully justifiable for you.
The issue is that I can only write off so much, let alone justify that sort of fun with five girls in their teens.
In short.
I'm jealous.
Really, really jealous.
A binder clip that very strong might be a good solution, but there is a drawback, but it could be remedied with changing how the tool is made. I have been looking to do a relid video today so this has been on my mind. I think if you use the inner portion of the delid tool and then clamp down onto that so the substrate is supported on the edges, it should give you a good seal, unless you use too much clamping force. As shown in the picture, the leading edge of the substrate is not supported and if you use too much pressure it gaps there.Waiting for the TIM to arrive, parts printed, but wondering if there shouldn't be some type of relid tool also; to hold pressure on the lid as the Permatex stuff dries. I guess I could just use the bottom piece and something to press on the lid and c-clam it again, but I dunno... Maybe I'm overthinking it, a binderclip might do the same.... Or is there actually a 3d printed relid tool? Found nothing on Thingiverse
My experiences have shown that sealing it down very well gives better temps. YMMV.I have another idea for relidding and resealing. Why not just use the cpu socket clamp for mounting pressure ? Should be enough, if one want's to reseal the IHS when new TIM and "insert you own choise of sealant here" has been applied.
Myself I don't reseal, just apply CLU on the core and put the bare CPU back in the socket, then place the IHS correctly on top an clamp it down in the socket and im good to go. Plus side of this is that there will be no sealant to interfere with the core/IHS contact pressure. One could argue the mounting pressure would be as [H]ard as it could get.
Waiting for the TIM to arrive, parts printed, but wondering if there shouldn't be some type of relid tool also; to hold pressure on the lid as the Permatex stuff dries. I guess I could just use the bottom piece and something to press on the lid and c-clam it again, but I dunno... Maybe I'm overthinking it, a binderclip might do the same.... Or is there actually a 3d printed relid tool? Found nothing on Thingiverse
I think it would be pretty easy to design a relid tool into the current design besides the clamp. But most folks don't really need that clamp most likely since you could use your own or stick it under the couch leg for the night.
Yes! then we can crush a 7700k @ 2 million FPSKyle, do you have access to something like a hydraulic press?
A competitive AMD is our only hope for that one.Has anyone tried suggesting to Intel to put quality TIM in their $400 products? Seems like an easier fix than all this mess.
Damn it Kyle! Stop tempting me with these delidding techniques. Must resist temptation to mess around with the CPU...
I really think the tool does not need to be 100% formed to just one type of cpu and witha bit more hole in the bottom/inside it can fit a broad variety of CPU units.
I though it was fairly well established that the TIM used is just fine, it's the separation between the top of the die and the underside of the IHS that is the issue. Which is why relidding is so dependant of proper seating and application of pressure (and why convex heatsink bases perform better than perfectly flat ones).which of course allows you to then remove the IHS and replace the somewhat anemic Intel Thermal Interface Material with something more robust.
For short term testing, or extreme overclocking, this is likely fine. But for long term operation, 'liquid metal' TIMs are not a good idea to use on bare dies. While the face of the die itself has a deposited metallic layer, the same is not true of the edges and underside of the die. The Gallium contained on those eutectic alloys is some nasty stuff and will quite happily infiltrate and redope Silicon (a few atoms of dopant will completely destroy a transistor). Particularly an issue with dies too small to be soldered (e.g. any LGA115x chip from Ivy Bridge onward), as they will lack the additional metallic layers of dies intended for soldering.We are using CoolLabs Liquid Ultra, and it has worked well giving us around a 20C temperature reduction in package temps using an Intel Core i7-7700K.
Hi guys,
Can i use the kaby tool for delid i7 4790k haswell cpu ?
Cordially.
Yes. Did a 4770K in the Hammer video.Hi guys,
Can i use the kaby tool for delid i7 4790k haswell cpu ?
Cordially.