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Thick paste spreadability?

J

J Macker

[H]F Junkie
Joined
Jan 25, 2001
Messages
10,167
I tried applying some Shin-etsu X23-7783D paste on my heatsink last night for my new i5 and the paste was extremely thick.

I've read a lot about the different methods (pea, lines, pre-spread) but I'm still worried that the paste may not be spreading evenly.

When pulling the heatsink off, I can't tell if it was spread evenly because the paste gets messed up when I lift the heatsink.

I guess I'm just going to try installing windows and giving it a go tonight. Do you guys have any recommendations for getting an even coat for extremely thick thermal paste?
 
the thick ones you want to spread out your self.. the pea, line methods wont work.. you can use an old credit card or the plastic bag and finger methods..
 
You need to heat up the Shin Etsu tube by placing in a mug of pre-warmed water. I take a coffee mug than microwave it for 1 minute. Then let the tube of SE sit in there for a few mins before applying. Then it spreads a lot easier.
 
No problem. I have used the stuff myself. I'm going to use it again when my Prolimatech Megahalems arrives.
 
[H] did a thermal paste round-up ,and included the Shin Etsu. They tried both the spread and pea drop method, and only noticed a .5C difference. My own testing with the same paste showed no tangible difference. If your cooler has a good mounitng sytem that has adequate pressure, either way will be virtually similar.
 
If you think about it, thick paste is alot like bread dough to work with. I use a paper clip opened up to spread it out. I just keep dabbing it, and it creates a nice crosshatch pattern that spreads nicely when you mount your HS. The paste won't stick to it like it will a credit card or plastic film.
 
IMO full coverage is more important than minor issues with "thickness". Go for as little as you think you can get away with and the heat and clamping force should spread it out. Eventually.

However the issue you describe is why I never use the "line or pea" method on high performance machines. Regardless of the paste, I manually spread a very thin layer with my finger in a baggie over the entire heat spreader and work some of the residue from the baggie over the entire base of the heatsink.

Physics is physics and the greater the contact area the greater the heat flow. I just cannot see how having any portion of the heatsink/heat-spreader interface lacking in thermal compound could be a good thing. Even with some of the 50 micron lapp jobs I do, I ensure with direct manual application that there is at least a thin glaze of compound over the entirety of both surfaces.

As to measuring the practical benefits/results, probably impossible without a million dollars of lab equipment. But it does keep me from worrying about it.
 
warming up paste can make it much easier to spread. heat up a cup of water in the microwave, throw the paste syringe in a ziploc bag, then dunk the bag in the water for a while to warm it up before you go to spread it. it will cooldown pretty quick once you apply it, but you can get a much better start with soft warm paste.
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