That is the LGA 3647 socket assembly compared to an LGA 2011 CPU. The Dynatron B2 will cover the area bounded by the outside edge of the rectangular retention bracket around the socket. And it has a completely flat base,so there's no clearance below it unlike the LGA 115x stock HSF.
The LGA 115x inner keep-out area (where you can be assured nothing will exceed the height of the IHS surface) is only 73mmx51mm, compared to the 108mmx78mm of the B2. Worse, to avoid intruding over the DIMMs that are typically palced right next to the outer keepout for LG115x (95x95) the B2 would need to be rotated so its 'long axis' is parallel to the DIMMs, so on the Z170i Pro Gaming it will hit both the upper VRM heatsink and lower chipset heatsink, as well as the left side heatsink. Sitting at the corners are the SATA headers and the EPS12V header which both sit even higher than the capacitors dotted around the socket, and spaces close enough 'sideways' that there is no way to avoid one without hitting the other. There's also the BIOS ROM chip sitting pretty tall in its socket right below the keep-out area.