Remove heat spreader on Core 2 Duo?

B

Bulls Eye

n00b
Joined
Nov 9, 2005
Messages
33
I'm wondering what everyone's opinion is on removing the heat spreader from their cpu's. I know it the past it usually helped to lower temps, but I'm wondering if it's still worth the risks to do it to a core 2 duo.
 
NordicRX8 said:
Get wetter! (watercooling) ;)
Click to expand...

Watercooling goes without saying :D

Just building a new rig, including replacing the water cooling parts, and didn't know if I should do it or not. It'll be at least a week before I can do anything anyways since I need to mod the mozart tx I got so it will fit two radiators side by side in the back, along with everything else.
 
there's a good post on xtreme about someone who used as to stick it to a pan and put it on the range or something to that effect. it's low melting solder
 
yea there is guides out there for doing it, there is also several members of various forums who are experienced in removing IHS' that will do it for you for a small fee. core2s are held on by a low temp solder, so you have to use a heatgun to melt it and carefuly pry it off, then melt and chip the residue off, its a long process and if you do it worng i know several people who have pulled the die off with it. for these chips though you only see a small (1-3C) drop in temps due to the use of the solder which transfers heat much better then glue or epoxys used in the past. i would say leave it, not worth throwing a couple hundred $ away if you mess up, or if you feel the need to do something, just lap the IHS some more
 
also the die lacks the hard shell it did back in the days of naked die. so the slightest uneven pressure by a heatsink or block and it could be bye bye die
 
agree with the crowd, not a good idea. Now if I had a shoebox full of conroes that cost me nothing, or were wealthy beyond my ability to spend it all before I died .... er nevermind.
 
How much diff does it make to lap vs not lap? I mean real temp deltas, any credible tests?
 
It depends on the physical flatness of both the thing being cooled (in my case the heat spread over the cores in c2d) and the thing cooling it (swiftech storm waterblock).

The flatter the two of them are, the better contact between them, and the better the heat transfer. Thermal compounds like arctic silver or liquid pro are designed to fill in microscopic (or sometimes not so microscopic) scratches or imperfections and provide more contact, not to to fill in major curves or scratches. That's why you put on as little AS5 a possible, because you want direct contact between the two, with thermal compound only where it's needed.

Many people are reporting a noticeable concavity to the heat spreader on the c2d's. So once I get mine, I'm assuming it'll need a little lapping to take the corners down a bit to get a much flatter surface.
 
on c2d the difference after lapping is huge, the IHS's on core 2 duos are incredibly concave, its quite horrible, i have a thread over in the intel forum of xtreme systems about it.
 
You must log in or register to reply here.
Back
Top