Got my B3 replacement board and ripped everything apart last night to put the new revision board in. I don't know what kind of double sided tape Corsair used on their mounting bracket that affixes to the back of the motherboard, but it took every ounce of strength I have to rip that thing off. I managed to get it off with most of the tape material intact, but the sticky portion of the tape is going back with the original motherboard to ASUS.
I cleaned the remaining thermal paste off the back of the cooler and processor and now I just need to reapply some new stuff. Wish I didn't have to wipe the slate clean as I understand the stock paste is Shin Etsu, but there's no way I could reinstall the H50 with the state the remaining paste was in. For anyone that's done this before, did you apply the paste via the pea method to the back of the processor or spread it evenly on the face of the H50? I'll be using some Arctic Silver I have as it's my only option at present.
I cleaned the remaining thermal paste off the back of the cooler and processor and now I just need to reapply some new stuff. Wish I didn't have to wipe the slate clean as I understand the stock paste is Shin Etsu, but there's no way I could reinstall the H50 with the state the remaining paste was in. For anyone that's done this before, did you apply the paste via the pea method to the back of the processor or spread it evenly on the face of the H50? I'll be using some Arctic Silver I have as it's my only option at present.