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Idle temps are 20C and Load were 41C at stock voltage and clocks with case cover off.
APC reported 172 watts at idle and 297 watts at load (LinX), which interestingly enough, is 125 watts difference.
We'll see how much more wattage she pulls when I crank her up to 3.8-4.0 Ghz.
I'm still amazed by the idle temps of the X6's!
Thanks Hashih, I'll get to OCing this weekend. The thing about AS5 (among others) is that you really need to have perfect mating surfaces for it to work as intended. Shin Etsu and other grey compunds don't need the mirror finish that AS needs. Sure you'll get cooler temps with each TIM on flat lapped surfaces, but AS is more dependant upon it and suffers worse from imperfect surfaces.
i read through this thread and it seems the boards that are having problems have the 890 chipset. has anyone reported this same problem with the 880gma boards?
specifically those with the 890GX chipset, the 890FX has not been hit by this mainly because they have the needed power phases, plus the cooling for them.
the GX boards tend to have a lower power phase(4+1) and no heat sync on the mosfet's
880's are not seeing the problem really(as far as I know)
What board do you have?
the 890 boards were designed with the x6 CPUs in mind, the older boards were not. I'd be surprised if that gigabyte board couldn't handle it.
I really don't think number of power phases have anything to do with the issues in this thread - 790/890FX boards all have 4+1 phases just like 890GX, 880, etc.
It's more a matter of how hot/stressed do the power regulation components get..
I just did an X6 1055T build for a friend on an 870 board which has no PWM cooling whatsoever and it's running beautifully, but this is a completely stock system which won't be overclocked.