smarenwolf
Weaksauce
- Joined
- May 7, 2018
- Messages
- 112
[H]ey forumsnists,
I've recently gotten my SFX-A4 and the parts for my first WC loop.
While I can't use the case yet (still have a mATX board), I'm already planning how to use it. I will get first experiences with WC with my current rig, but i'd still like some feedback for my "grand/miniscule" plan from the guys who know their shit
So... The SFX-A4 will be equipped with an overclocked i7-8700K or newer and an overclocked GTX 1080Ti or newer.
Both will be watercooled by a QDC'able external rad. For the beginning, this will be a EKWB XE-360.
The challenging part comes from two "wishes" I want to achieve:
- everything besides radiator internally
- as much hardline as possible (I am flexible, doesn't need to be 100% hardline )
I came up with this cunning plan!
Part of the plan rests on three circumstances:
1) The overall width of the case will be a few milimeters wider, as I'll switch the sides with custom acrylic/TG panels
2) A LC'd 1080Ti is basically single slot, which means more space (probably something between 13 and 16mm, not sure) between the card (or its block) and the sidepanel
3) The PSU will probably be a nonmodular PSU that has been worked on by an electrician (for cables of the appropriate length), this results in more space under the PSU, as modular cables come with not-so-space-efficient connectors.
The loop is planned as follows:
- cold (blue) water enters the case on the backside (single slot gpu would allow for a pci-slot-cover with holes for the couplers, the image doesn't represent that yet), bends to the sidepanel and goes from there to the bottom of the case (above the PSU cable, but below the riser). It will mostly run nearly touching the sidepanel.
- it then enters the "thickened" base of a custom 3D printed reservoir. This reservoir takes up the space between the GPU-block and the outside of the case, as the sidepanel will be cut out in a trapezoid shape to expose the reservoir. This gives the reservoir a few more milimeters in thickness (the thickness of the sidepanel, to be exact). The bottom of the radiator extends behind the sidepanel to the bottom of the case, where it thickens (no GPU here) to allow for G1/4 threads and room for accompaning fittings.
- from the backside of the reservoir, the cold (blue) water goes into the pump-IN (DDC with a cover that has both IN and OUT on the side, not like - for example - the EK-tops that have IN on the top of the pump).
- cold (blue) water is then moved under/above the RAM to enter the CPU
- warmed (purple) water exits the CPU and is run to the corner of the MoBo to reach behind the MoBo-tray. There it connects with the GPU-block
- hot water (red) exits the case through a QDC-coupler on the backside of the case or through a hole in the pci slot cover.
The tolerances and free spaces _should_ enable me to do this. Opinions?
I've recently gotten my SFX-A4 and the parts for my first WC loop.
While I can't use the case yet (still have a mATX board), I'm already planning how to use it. I will get first experiences with WC with my current rig, but i'd still like some feedback for my "grand/miniscule" plan from the guys who know their shit
So... The SFX-A4 will be equipped with an overclocked i7-8700K or newer and an overclocked GTX 1080Ti or newer.
Both will be watercooled by a QDC'able external rad. For the beginning, this will be a EKWB XE-360.
The challenging part comes from two "wishes" I want to achieve:
- everything besides radiator internally
- as much hardline as possible (I am flexible, doesn't need to be 100% hardline )
I came up with this cunning plan!
Part of the plan rests on three circumstances:
1) The overall width of the case will be a few milimeters wider, as I'll switch the sides with custom acrylic/TG panels
2) A LC'd 1080Ti is basically single slot, which means more space (probably something between 13 and 16mm, not sure) between the card (or its block) and the sidepanel
3) The PSU will probably be a nonmodular PSU that has been worked on by an electrician (for cables of the appropriate length), this results in more space under the PSU, as modular cables come with not-so-space-efficient connectors.
The loop is planned as follows:
- cold (blue) water enters the case on the backside (single slot gpu would allow for a pci-slot-cover with holes for the couplers, the image doesn't represent that yet), bends to the sidepanel and goes from there to the bottom of the case (above the PSU cable, but below the riser). It will mostly run nearly touching the sidepanel.
- it then enters the "thickened" base of a custom 3D printed reservoir. This reservoir takes up the space between the GPU-block and the outside of the case, as the sidepanel will be cut out in a trapezoid shape to expose the reservoir. This gives the reservoir a few more milimeters in thickness (the thickness of the sidepanel, to be exact). The bottom of the radiator extends behind the sidepanel to the bottom of the case, where it thickens (no GPU here) to allow for G1/4 threads and room for accompaning fittings.
- from the backside of the reservoir, the cold (blue) water goes into the pump-IN (DDC with a cover that has both IN and OUT on the side, not like - for example - the EK-tops that have IN on the top of the pump).
- cold (blue) water is then moved under/above the RAM to enter the CPU
- warmed (purple) water exits the CPU and is run to the corner of the MoBo to reach behind the MoBo-tray. There it connects with the GPU-block
- hot water (red) exits the case through a QDC-coupler on the backside of the case or through a hole in the pci slot cover.
The tolerances and free spaces _should_ enable me to do this. Opinions?