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Need help applying Arctic Silver 5

D

Dennisphere

n00b
Joined
May 20, 2011
Messages
6
So I revised my cpu loop and figured it a good time to clean the cpu and its block and apply new AS5. I have included photos of how I applied the paste. I did it according to the AS5 instructiins, however I am curious if this is the best way. My temps are not great, although they should be. I am auto overclocking a 2600k via ASUS bios and mu idle temps are mid to upper 30s. Full load is upper 50s. I am contemplating re-seating the block using a pea-shaped portion of AS5.

image.jpg
 
First thing i would check is the voltage to the cpu. Im not too familiar with that processor but i know using the preset oc in the bios on my asus board it kicked my voltages up way higher than needed.
 
I dont remember what OC i had before, I've fooled around with offset voltage and manual voltage, and at its coolest, I had idle temps around 29-32 and 100% load peaking at 46-47 C

If I can find an option in bios to increase turbo voltage, I might try fiddling with a (-) offset voltage again... Still not 100% sure it isn't the job I did with the AS5 though
 
It's been a long time since I built a machine so maybe things have changed, but arn't you suppose to spread it very thinly? I usually use a business card or other small piece of straight edge cardboard. Sometimes even just cut out a small piece from a cardboard box in the recycling (like a cereal box, not a big double ply box)

The idea is you want the thermal paste to fill in any imperfections in the heatsink/cpu while maintaining a full surface contact.
 
Red Squirrel said:
It's been a long time since I built a machine so maybe things have changed, but arn't you suppose to spread it very thinly? I usually use a business card or other small piece of straight edge cardboard. Sometimes even just cut out a small piece from a cardboard box in the recycling (like a cereal box, not a big double ply box)

The idea is you want the thermal paste to fill in any imperfections in the heatsink/cpu while maintaining a full surface contact.
Click to expand...
Not really necessary to spread it manually.When you install the heatsink properly,it'll squeeze the paste evenly across the IHS surface.
 
Hang on, I honestly think thats waaaaaaay tooo much.

A BB sized drop in the center of the CPU will spread evenly and help prevent air pockets. Dont spread anything around.
 
I would do as Slufa111 said before me - make a little pea in the middle of the CPU. I Find the "line-method" makes it hard to get the best amount of paste, plus you know it will spread evenly with the "pea-method". Don't spread it around evenly yourself - that will create air pockets, no matter how careful you are. This video explains it nicely: [ame="http://www.youtube.com/watch?v=EyXLu1Ms-q4"]YouTube - ‪How Thermal Compound Spreads‬‏[/ame]

I can't tell if you used too much there - it doesn't look too bad for me though.
 
Honestly, upper 50's isn't too bad, and it can always be worse. I would take the one posters suggestion and check the voltages. Unless you are going for extreme overclocks, just return everything to defaults, and up the multiplier first and see what your temps are at that point. Then if you want a higher clock, change back to the auto overclock if it was higher and check the differences.
 
Slufa111 said:
Hang on, I honestly think thats waaaaaaay tooo much.

A BB sized drop in the center of the CPU will spread evenly and help prevent air pockets. Dont spread anything around.
Click to expand...

applies to most single or dual core processors but for the quad core i5s, the cpu's are best covered by a line down the middle or double lines.

Spreading it around yourself with a credit card works as well. I had a problem where my settings were the same and temps went up to mid 30s. I got an RMA from corsair for my h60 and now back down to high 20s.

What cooler are you using? and what voltage are you using?
 
tnt3k said:
applies to most single or dual core processors but for the quad core i5s, the cpu's are best covered by a line down the middle or double lines.

Spreading it around yourself with a credit card works as well. I had a problem where my settings were the same and temps went up to mid 30s. I got an RMA from corsair for my h60 and now back down to high 20s.

What cooler are you using? and what voltage are you using?
Click to expand...

Spreading around your thermal compound creates air bubbles which will create MAJOR heat problems.

Note taken when I upgrade!
 
Slufa111 said:
Spreading around your thermal compound creates air bubbles which will create MAJOR heat problems.

Note taken when I upgrade!
Click to expand...

this.

also AS5 is a bitch to spread properly (as the vid in 'Idef1x' shows). i use AS5, and i'm thinking of getting something else because of this.
 
I always used a pea size in the middle and a bit out from the four corners. That way it spreads evenly. Never had a problem.
 
aphasia said:
this.

also AS5 is a bitch to spread properly (as the vid in 'Idef1x' shows). i use AS5, and i'm thinking of getting something else because of this.
Click to expand...

it is very hard to spread around. I'm saying the spread is good too if you are able to do it very well. The H60 comes pre-spread with shin-etsu and its very good actually.
 
I always spread it before application (that's what she said...). It ensures you don't use to much, and helps it spread easier if the surfaces aren't perfect. To each...

EDIT: I use a piece of Saran wrap around my finger to spread it.
 
All the user saying you need to spread the compound on the CPU should watch the video I linked earlier in the thread. I am not saying it's impossible to make an alright contact if you spread it out, I'm just saying it's a lot harder to avoid trapped air (if not impossible).

But I guess every user has his own method of applying thermal paste. but I know which method I'm comfortable with: a pea in the middle.
 
CruisD64 said:
I always spread it before application (that's what she said...). It ensures you don't use to much, and helps it spread easier if the surfaces aren't perfect. To each...

EDIT: I use a piece of Saran wrap around my finger to spread it.
Click to expand...

Fail.




Try it my method or the line method to get PROPER contact.
 
Slufa111 said:
Hang on, I honestly think thats waaaaaaay tooo much.

A BB sized drop in the center of the CPU will spread evenly and help prevent air pockets. Dont spread anything around.
Click to expand...

Agreed. I remember when I used to think more paste was better. :p
 
CruisD64 said:
I don't claim to know EVERYTHING, but I know a lot. ;)
Click to expand...

Nor do I, but at least when someone explains the proper method and references video proof I don't foolishly stand my ground and claim their logic to be false.
 
Well, let us not make this a juvenile argument of who is wrong, and who is right. People can use whichever method they find best. If people get the temperatures they seek, then peace be with it.

In my opinion, people should instead tell us why they prefer a specific technique. I for instance like the drop in the middle of the CPU, since I find it easier to get the right amount; it requires no fiddling to even the paste out, and I am sure it makes a fine contact.
 
mhenley said:
Nor do I, but at least when someone explains the proper method and references video proof I don't foolishly stand my ground and claim their logic to be false.
Click to expand...

Is that what I did? Foolishly stood my ground? Reread my original post. To each...
 
Idef1x said:
Well, let us not make this a juvenile argument of who is wrong, and who is right. People can use whichever method they find best. If people get the temperatures they seek, then peace be with it.

In my opinion, people should instead tell us why they prefer a specific technique. I for instance like the drop in the middle of the CPU, since I find it easier to get the right amount; it requires no fiddling to even the paste out, and I am sure it makes a fine contact.
Click to expand...

My reasoning behind it is that not all surfaces are the same. We'd like them to be, but they're not. Maybe with a perfectly flat lapped surface, the drop method will work fine. However, with some HDT style heatsinks, you don't get that. I've had 2 OCZ Vendetta 2's and a Xigma DK, and I can tell you that spread was not even. I also encountered issues with the Arctic Cooling 64 heatsink during my AMD X2 days. the bottom of those heatsinks were rough so paste didn't spread evenly. Upon spreading the paste, the temps decreased. I dunno... maybe it's just me

EDIT: You were right btw, I didn't watch the video. I just thought I didn't need to since my experiences have differed.
 
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1: If the surfaces were lapped perfectly flat, there would be no point of paste as the purpose of the paste is to fill in those gaps. 2: During mating, if the paste is in the center there will be no air bubbles as it spreads outwards, whereas if you spread, then the peaks and valleys that are guaranteed to be there as a result of human error will cause air bubbles, which do not transfer heat as well as paste does, therefore reducing thermal conduction and increasing temperatures. Also, as a side note, if you purchase a heatsink that has some type of thermal paste pre-spread on it and you DON'T clean it off, then you're not [H]ard enough.

The video shows these bubbles plainly during the spread test and you can also see that every blob or line type test results with zero air bubbles because as the heatsink is pressed down the paste spreads out with the increased pressure filling in all available gaps.

Now, for the terribly machined sinks, I can see spreading paste to fill in gaps them wipe off the excess and then proceeding to a blob or line application for the installation, but thankfully we don't typically have to worry about shoddy craftsmanship on top end heatsinks.

EDIT: Please, if you haven't watched the video, watch it. I was a fan of spreading until I saw it. I will emphasize the past tense of that sentence.
 
I watched it. I can see its validity. I was referring to poorly machined HS's, like the ones I listed.
 
Place single Dot in the Center of the CPU or Apply even layer all over the CPU. Both works for me. :)
 
http://hardocp.com/article/2009/04/07/thermal_paste_shootout_q209/3

/thread

I've always used a dot in the middle, except the first type of TIM I bought which was the ZM-STG1 which is supposed to be spread out (and as such comes in a nail polish bottle).
Now using AS5, OCZ Freeze, and a few others....the dot always worked fine for me. Spreading it out = a waste of TIM.

If you have a few minutes to kill and you want to see a comparison of all the ways you can apply it ~ http:// benchmark reviews . com/index.php?option=com_content&task=view&id=170&Itemid=1&limit=1&limitstart=3
 
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I was also one who spread the paste until I saw this article and watched the video, good stuff! Swapping my heatsink out for a H50 in a few days, will be using the line method from now on. :D

Thanks for the info, guess an old dog like me can still learn a new trick or two.... :)
 
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