Leveling the copper plug on stock intel HSFs

Discussion in 'Overclocking & Cooling' started by duronboy, May 14, 2019.

  1. duronboy

    duronboy [H]Lite

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    NfCaUca.jpg

    That little copper plug sticks up half a millimeter so that's the only area contacting what you're trying to cool. Has anyone leveled that off?

    I would think ideally it would be pressed further in so no material is lost.

    I don't know how thermal expansion works. Would it theoretically be easier to press them together more if both pieces were cold, or if the aluminum were hot and the copper cold?

    Could just stick it in a vice and see what happens. Just thought I'd ask.
     
  2. VanGoghComplex

    VanGoghComplex [H]ard|Gawd

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    Aluminum has a larger thermal expansion coefficient than copper, so if you're going to press it I think hot would be the way.

    Would the mounting pins tolerate the half millimeter of height change, though? You'll wind up with less mounting pressure at best. May not be a problem; it's been a while since I looked at a stock Intel HSF.

    I don't think you'll see much of a difference by increasing the area, but I could be wrong. Got a donor you're willing to potentially destroy in order to test? XD
     
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  3. Kardonxt

    Kardonxt 2[H]4U

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    Honestly the heatsink is so small I don't think the extra cpu surface area would help. I think the copper core is enough to saturate what little aluminum there is.

    Intel has apparently stopped making \ using the thicker versions of these and we are now getting these thin garbage pentium line heatsinks even with i7-9700(non k)s.
     
  4. duronboy

    duronboy [H]Lite

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    Its been in a drawer for 7 years, its going to cool one of those DOB LEDs. The copper area isnt even as large as the LED array, but there are some components around the edge with no contact with the heatsink. I dont know how well the aluminum backing on the LED transfers heat sideways.

    I guess ill pop the heatsink in the oven for a bit then squish it in the vice.