https://www.techpowerup.com/331392/intel-nova-lake-test-cpu-appears-targeting-2026-launch
https://overclock3d.net/news/cpu_mainboard/intel-nova-lake-leaks-hint-a-huge-core-count-increase/
Leaks show a dual chiplet variant where each chiplet is an 8+16 configuration, so 16 performance cores and 32 efficient cores
Supposedly Intel has already begun shipping variants of the CPUs to OEMs and AIBs for validation testing, rumors say the chips are primarily on the Intel 18A node.
https://www.tomshardware.com/pc-com...-samples-intended-for-validation-and-research
https://www.msn.com/en-us/lifestyle...ut-things-are-more-complicated-on-the-desktop
It's worth noting that the Intel 18A node seems to have better power delivery than TSMC's current 2N process, but TSMC is doing better with SRAM cell size.
TSMC uses a power workaround they named "NanoFlex", but backside power delivery isn't coming back until the TSMC A16 node.
https://www.tomshardware.com/tech-i...et-nanoflex-n2p-loses-backside-power-delivery
Here's a little info on Backside Power Delivery and why it is crucial for GAA designs, as Intel learned early on and TSMC is learning now.
https://semianalysis.com/2024/10/01/clash-of-the-foundries/
Without backside power delivery, the smaller the chip, the better, so I suspect that Intel continues to use TSMC for its GPU functionality with the CPU being on the Intel 18A node... that is speculation, but given that moving a GPU design down the TSMC stack is probably easier than moving it to a completely different tech it seems reasonable to me that Intel leaves the AI and GPU stuff at TSMC until they do their next major redesign.
https://overclock3d.net/news/cpu_mainboard/intel-nova-lake-leaks-hint-a-huge-core-count-increase/
Leaks show a dual chiplet variant where each chiplet is an 8+16 configuration, so 16 performance cores and 32 efficient cores
Supposedly Intel has already begun shipping variants of the CPUs to OEMs and AIBs for validation testing, rumors say the chips are primarily on the Intel 18A node.
https://www.tomshardware.com/pc-com...-samples-intended-for-validation-and-research
https://www.msn.com/en-us/lifestyle...ut-things-are-more-complicated-on-the-desktop
It's worth noting that the Intel 18A node seems to have better power delivery than TSMC's current 2N process, but TSMC is doing better with SRAM cell size.
TSMC uses a power workaround they named "NanoFlex", but backside power delivery isn't coming back until the TSMC A16 node.
https://www.tomshardware.com/tech-i...et-nanoflex-n2p-loses-backside-power-delivery
Here's a little info on Backside Power Delivery and why it is crucial for GAA designs, as Intel learned early on and TSMC is learning now.
https://semianalysis.com/2024/10/01/clash-of-the-foundries/
Without backside power delivery, the smaller the chip, the better, so I suspect that Intel continues to use TSMC for its GPU functionality with the CPU being on the Intel 18A node... that is speculation, but given that moving a GPU design down the TSMC stack is probably easier than moving it to a completely different tech it seems reasonable to me that Intel leaves the AI and GPU stuff at TSMC until they do their next major redesign.