IBM's breakthrough cooling technology?

[jebo_4jc]

Not exactly sure what I think about this yet. Could this be applied to the top of a heatspreader, or only the bottom?

http://www.digg.com/hardware/Has_IBM_changed_CPU_cooling_forever

 

[Arcygenical]

PROTIP: don't use a turkey baster to apply the paste.

 

[jebo_4jc]

PROTIP: don't use a turkey baster to apply the paste.

What's wrong with that? Any extra paste just runs out the sides!

 

[TehQuick]

weird, the pic on the IBM research page shows the application of this new technology at the bottom of cpu's heat spreader, ie b/n the heat spreader and the actual cpu chip. I'd guess the headspreader will need those "hierarchical branded channels" on both top and bottom...

 

[jonathonball]

i'd like to see how that stacks up against lapping.

 

[TehQuick]

That's the point, IBM researchers say ideally flat surface is bad for cooling since it does not spread the paste all that well...

 

[jebo_4jc]

weird, the pic on the IBM research page shows the application of this new technology at the bottom of cpu's heat spreader, ie b/n the heat spreader and the actual cpu chip. I'd guess the headspreader will need those "hierarchical branded channels" on both top and bottom...

I guess that makes the most sense

Although looking at it again it appears IBM's design actually includes the heatsink or waterblock as part of the heatspreader. i.e. the heatspreader and the heatsink are the same thing.

 

[TehQuick]

Actually, they don't, they just indicate is as "cooling medium" which can mean anything. I suspect it's gonna be tough selling cpus with integrated coolers, that'd kill the whole market for those things

BTW, IBM's press release is here - http://www.zurich.ibm.com/news/07/cooling.html