So I just got my new build together and the one thing I was worried about was temps.
I have the Lian-Li g70 which has a total of 6x120mm Scythe S-Flex fans @ 63CFM. For the CPU I'm using the SI-128 paired another S-Flex.
The temps below are from Intel's TAT/CoreTemp. Stock speed (2.4 @ 1.325v).
Idle: 43/44
Load: 46/47 (When I say load, I mean 3DMark06 Load.)
I'm almost positive those are pretty bad, especially for the cooling of the case, and the heatsink I'm using.
My other identical system is Idling at about 36-40 and loading at 41-43 (3DMark06 Load). Am I to guess bad HS contact or bad application of thermal compound?
Speaking of which, for thermal compound -> AS5 or Ceramique? Right now both machines are using Ceramique . . .
Cheers
I have the Lian-Li g70 which has a total of 6x120mm Scythe S-Flex fans @ 63CFM. For the CPU I'm using the SI-128 paired another S-Flex.
The temps below are from Intel's TAT/CoreTemp. Stock speed (2.4 @ 1.325v).
Idle: 43/44
Load: 46/47 (When I say load, I mean 3DMark06 Load.)
I'm almost positive those are pretty bad, especially for the cooling of the case, and the heatsink I'm using.
My other identical system is Idling at about 36-40 and loading at 41-43 (3DMark06 Load). Am I to guess bad HS contact or bad application of thermal compound?
Speaking of which, for thermal compound -> AS5 or Ceramique? Right now both machines are using Ceramique . . .
Cheers