• Some users have recently had their accounts hijacked. It seems that the now defunct EVGA forums might have compromised your password there and seems many are using the same PW here. We would suggest you UPDATE YOUR PASSWORD and TURN ON 2FA for your account here to further secure it. None of the compromised accounts had 2FA turned on.
    Once you have enabled 2FA, your account will be updated soon to show a badge, letting other members know that you use 2FA to protect your account. This should be beneficial for everyone that uses FSFT.

CPU won't stay put

E

EnderW

[H]F Junkie
2FA
Joined
Sep 25, 2003
Messages
11,459
A while back I had to rma my IC7-G. When I got it back, I noticed the brown lever on the CPU socket had been replaced with a metal bar. A few weeks later, after putting it in the case, I took it out and switched CPUs, when I took my HSF off, there was no processor in the socket - it was stuck to the bottom of the HSF, but the metal bar was still in the locked position.

I rmaed that board b/c of that, but I got another one just like. I was tired of messing with the RMA process and otherwise the board seems perfect, and I don't see how it can be that much of a problem when the HSF is attached, b/c it is pressing down on the CPU and it can't go anywhere.

Thoughts, comments?
 
Did you use a thermal pad or paste? IMO I think some of those pads are made of glue. Does anyone else remember a few years back when P4s were still new. Some site was testing heatsinks and the thermal pad was so stuck to the processor that it actuall pulled the heat spreader off??
 
brom42 said:
Did you use a thermal pad or paste? IMO I think some of those pads are made of glue. Does anyone else remember a few years back when P4s were still new. Some site was testing heatsinks and the thermal pad was so stuck to the processor that it actuall pulled the heat spreader off??
Click to expand...

yes I used AS5, that's what stuck it to the HSF

and I mean stuck!! that thing was a bitch to get off, b/c you can't really get a grip on it, but I was able to twist it so the corners weren't aligned anymore and get it off that way
 
Most people run their rig for a few before taking the HSF off... This thins the AS5 a bit.
 
yeah, when that stuff sits it gets kinda crusty from my experiences. I have seen a p4 3.0 stuck to the bottom of a pelter because of thermal paste, no biggie unless you bend pins, that happens with p4's, i han't seen it happen on a athlon though, that really doesn't mean it can't happen though
 
That's pretty normal for the cpu to get stuck to the hsf if you're using a thermal pad or have a thick layer of any kind of paste on it. Can't believe the board was RMA'd because of that. Trick is to apply a really thin layer and that won't happen. If it still sticks, run the box and heat up the cpu and it should be easier. It used to happen to me a lot then I started applying less artic silver and I haven't had any problems since.

Good luck
 
eyedol said:
That's pretty normal for the cpu to get stuck to the hsf if you're using a thermal pad or have a thick layer of any kind of paste on it. Can't believe the board was RMA'd because of that. Trick is to apply a really thin layer and that won't happen. If it still sticks, run the box and heat up the cpu and it should be easier. It used to happen to me a lot then I started applying less artic silver and I haven't had any problems since.

Good luck
Click to expand...

seems like there was another problem with it too, but I can't remember

and I apply less AS5 now then when I first built it with the original board and it never came out of that one, that's why I thought this weird new lever was the culprit

any tips on spreading the AS5 out?
 
HSF pulling processor isn't much to worry about. and maybe if the processor is stuck to the HSF u can just put a flat head screw driver between the proc. and the HSF and twist the screw driver
 
After using the cpu and heatsink with thermal compound, you should give the heatsink a quarter circle twist to break the seal between the heatsink and cpu, then you can remove it without yanking out the cpu.
 
but if it is a intel cpu then how r u going to twist it inside the black fan holders around the socket
 
BillLeeLee said:
After using the cpu and heatsink with thermal compound, you should give the heatsink a quarter circle twist to break the seal between the heatsink and cpu, then you can remove it without yanking out the cpu.
Click to expand...

I'll try that next time, but I think it will still come out. Heard you were thinking of trading your P4 for a A64 setup, made a decision? I'll probably keep mine until March or so, then build a nice NF4/S939 system.



kevinf said:
but if it is a intel cpu then how r u going to twist it inside the black fan holders around the socket
Click to expand...

I'm not using the stock HSF ;)
 
EnderW said:
Heard you were thinking of trading your P4 for a A64 setup, made a decision?
Click to expand...

I'm waiting till next year at the earliest as well and seeing what the future holds for me to waste my money on.
:D
 
BillLeeLee said:
I'm waiting till next year at the earliest as well and seeing what the future holds for me to waste my money on.
:D
Click to expand...

Good idea. I've seen a couple of NF4 boards that look like they will be awesome, but I'll wait for all of them to come out so I can waste hours reading reviews and forums while everyone else sorts out all the bugs. :D
 
You must log in or register to reply here.
Back
Top