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Best thermal paste pattern?

D

da233

Limp Gawd
Joined
May 3, 2007
Messages
303
I did a lot of googling on this, and got a lot of mixed answers.

Some people just put a drop in the middle. Some people do a vertical line. Others do two vertical lines. Some do an X cross shape. Some people do the credit card spreading method.

To make things even more confusing, some people say to put it on the heatsink instead of the cpu.


So, now I'm even more confused. How do you guys recommend to do it?

I have a 2500k and a Coolermaster 212, if that makes any difference.
 
The last I read some review site did a test of all the methods and found that the dot method (on the CPU) was the best for temperatures. Which is convenient because it's by far the easiest.

Edit: Youtube video showing why not to pre-spread the tim (AKA credit card method). youtube
 
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pea or rice size in the middle seems to be the best, the heat and pressure with distribute it.
 
This is not the article, but HardOCP had an article dedicated to testing the differences between using a pea drop in the center of the die vs even spreading.

Ceramique works best being evenly spread on a die, whereas most other compounds work best as a pea/rice-sized drop in the middle of the die. If someone could locate that HardOCP article comparing the differences, that would be greatly appreciated.
 
I always do the CC spreading method. That way I know for sure it's got a nice thin coating over the entire surface.
 
Just put a small dot in the middle and be done with it because It wont make an appreciable difference anyway you apply it. I dont understand why people obsess with these minor details. If you're that worried about temps get a better cooler.
 
I guess I'm not allowed a direct a link/altered link but Benchmark Reviews has the best guide for thermal paste application I've ever seen.

The article is under "Featured Guides" and was published Monday, 21 April 2008 by Olin Coles and it's the most detailed guide I've ever seen for every type of mounting base.

Go to Benchmark reviews and get some insight. It's well worth your time.


Good Luck!
 
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First I clean off all the crap that comes preglooped on the heatsink. Then I apply my own dot method with very small dots in a 6 pattern (like the 6 on dice). Then I attach the heatsink firmly pressing down to spead the die, then I gently twist the heatsink to spread it further to make sure I get it all around.
 
lasserith said:
The last I read some review site did a test of all the methods and found that the dot method (on the CPU) was the best for temperatures. Which is convenient because it's by far the easiest.

Edit: Youtube video showing why not to pre-spread the tim (AKA credit card method). youtube
Click to expand...

Where does that video show not to pre-spread with the credit card? It is saying don't use the pre-spread that comes with the heatsink where they cover the entire die with paste. That is not at all what you do with the credit card method. The purpose of the credit card method is to work some of the paste into the crevices of the heatsink block. Then you wipe off the excess. Then you use one of the methods shown in that video. The best thing to do is follow the instructions provided by the thermal paste company pursuant to the type of paste you are using. For instance, Artic Silver 5, they recommend using the credit card method, then wiping off the excess, then using the line method, with a slight twist. You wouldn't use that same technique with some other types of paste though.
 
There is a video somewhere, not sure if it is the one linked, that shows spreading the compund by hand (credit-card method) leaving small air bubbles trapped in the paste. That is why they don't recommend spreading it manually. Putting a dot or line (whichever, they both work) and letting the heatsink compression spread the paste didn't cause the air bubbles.
 
Considering the tiny tiny amount of thermal paste needed in the dot method, I would say that applying a line or X of it is a sure way to use too much paste. You run no risk of trapping air bubbles though because the heatsink is spreading the paste.

Using a credit card opens up the possibility of air bubbles and possibly too much paste, and you're going to have a bunch of paste where you don't need it. Covering the whole square might look pretty, but you don't need those edges.

Remember that you want just barely enough paste to fill the gaps between your processor and heatsink. Any more than that, and the paste can act like an insulator. That is why I recommend a tiny dot in the middle, and just let your heatsink do the spreading.
 
Shameless Liar said:
Using a credit card opens up the possibility of air bubbles and possibly too much paste, and you're going to have a bunch of paste where you don't need it. Covering the whole square might look pretty, but you don't need those edges.
Click to expand...

Forceman said:
There is a video somewhere, not sure if it is the one linked, that shows spreading the compund by hand (credit-card method) leaving small air bubbles trapped in the paste. That is why they don't recommend spreading it manually. Putting a dot or line (whichever, they both work) and letting the heatsink compression spread the paste didn't cause the air bubbles.
Click to expand...

I think you guys are looking or watching the wrong method then. I have used that method for years without ever having a problem and almost always come up with better temps. The whole point of that method is to have "less" air bubbles. When done properly it definitely eliminates more air bubbles. You don't "spread" the paste with the credit card. What you do is you "stain" the heatsink. What they mean by that is you dab just little bits of paste and you scrape it off with the credit card. You aren't smearing or spreading. You then wipe it down with a lint free cloth to remove any extra paste. You then use one dot in the mid or a line on the heat spreader of the cpu and push down the heatsink, then twist slowly one way and then the other to remove air bubbles and obtain good coverage. Doing that should eliminate any air bubbles at all.

What you guys are referring to is spreading the paste with a card and then applying the heatsink to the CPU, that is not at all what the credit card method is supposed to be.
 
^^ different thermal paste material works better applied differently

As said before, for example, ceramique tends to work better being spread evenly across the whole die than it does being rice/pea-dropped in the center. But for silver, it tends to work better being rice/pea-dropped instead.

I *know* there was a HardOCP article specially on this, but I can't find it. It was very informative and interesting; lots of test results.
 
aronesz said:
^^ different thermal paste material works better applied differently

As said before, for example, ceramique tends to work better being spread evenly across the whole die than it does being rice/pea-dropped in the center. But for silver, it tends to work better being rice/pea-dropped instead.

I *know* there was a HardOCP article specially on this, but I can't find it. It was very informative and interesting; lots of test results.
Click to expand...

+1

Yes, they all work differently. The stickier substances like silver, I usually apply the dotted grid method, with very small dabs in a die 6 pattern. The ceramique usually works well when you place one larger dab in the middle and let it spread out naturally. That is what the video was actually showing.
 
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