I'm building my first water cooled rig with some rather hot parts, and I can't seem to get a concensus of opinion on the water flow path.
C2D q6700
2 X 8800GTS in SLI using KOOLANCE VID 280 waterblocks with KOOLANCE bridge connector
KANDALF LCS case
Suggestions I have had are:
PUMP-->CPU-->GPU-->RAD-->RES (series connection)
PUMP-->GPU-->CPU-->RAD-->RES ( " " )
PUMP-->Y connect in--> CPU-->Y connect out-->RAD-->RES
GPU
PUMP-->GPU-->RAD-->CPU-->RES
In the first option the presumption is the GPU is still hotter than the hot CPU water so thermodynamically cooling should take place.
In option 4 the hot GPU water is cooled before returning to cool the hot (OC) CPU
In option 3 with a parallel path water temps going in would be the same temp, BUT what about flow resistance?
Any thoughts and suggestions?
C2D q6700
2 X 8800GTS in SLI using KOOLANCE VID 280 waterblocks with KOOLANCE bridge connector
KANDALF LCS case
Suggestions I have had are:
PUMP-->CPU-->GPU-->RAD-->RES (series connection)
PUMP-->GPU-->CPU-->RAD-->RES ( " " )
PUMP-->Y connect in--> CPU-->Y connect out-->RAD-->RES
GPU
PUMP-->GPU-->RAD-->CPU-->RES
In the first option the presumption is the GPU is still hotter than the hot CPU water so thermodynamically cooling should take place.
In option 4 the hot GPU water is cooled before returning to cool the hot (OC) CPU
In option 3 with a parallel path water temps going in would be the same temp, BUT what about flow resistance?
Any thoughts and suggestions?