Steve-o-man
Weaksauce
- Joined
- Jan 16, 2006
- Messages
- 81
So I was removing the HSF from my CPU and the CPU came up attached to the HSF...ripped out of it's socket. Will it be OK? I can't test it right now and I have to know if I'm jacked...
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It was a PGA.....the funny thing is I hardly put any pressure on it at all. I gave it a slight tug and it didn't come. I pulled fractionally harder and the whole thing came out, CPU attached to the bottom of the HSF. Happened twice (I was swapping 2 CPUs). System one (ABIT IC7) booted up fine (this one came out the hardest). Sytem two (Intel D875PBZ) isn't booting (this one took almost no pressure and the whole thing came out). Suggestions?empoy said:if the processor is LGA it should be OK. But if have a PGA processor and it got yanked out of its socket, then you must have given it quite a lot of pressure.
Could it damage something in the socket though?ChronicTrees said:That has happened to me soooo many times, never had any bent pins. As long as you didn't bend any pins in the removal process you are fine.
Steve-o-man said:Could it damage something in the socket though?
Steve-o-man said:Could it damage something in the socket though?
r00k said:edit: "I can't test it right now and I have to know if I'm jacked" [/wiseass remark]
nah this happens all the time, that thermal adhesive forms a very nice airtight seal between 2 flat surfaces. usually best to wiggle back and forth if possible, but yeah it doesnt take a lot of force to just pull the whole assembly out without unlocking the ZIF. thing to remember though, is that youre pulling all the pins at once, and distributing the force, not just one pin.
Donnie27 said:Dude, I used the AS5 TIM Grease and NOT adhesive
r00k said:it was my bad - as i don't really use adhesive i tend to use them interchangeably. anyhoo /me is clueless in this thread it seems![]()