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Slides from AMD reveal that there are at least three variants of Vega 10 GPU packages in existence. While the differences appear to be lesser than a millimeter, the inconsistencies are making it difficult for board partners and already causing production issues.
The variants come from different factories that equip Vega 10 with different memory chips. The main difference is lack of molding on the non-resin variant. These chips are reportedly harder to use for custom designs as the GPU is 40 μm higher than HBM2 modules. It’s also worth noting that molded and unmolded design have 0.1 mm difference in GPU height. Which is actually much bigger issue than it may sound. If that wasn’t enough, there’s also (allegedly) a fourth resin variant strictly for RX Vega 56.
The variants come from different factories that equip Vega 10 with different memory chips. The main difference is lack of molding on the non-resin variant. These chips are reportedly harder to use for custom designs as the GPU is 40 μm higher than HBM2 modules. It’s also worth noting that molded and unmolded design have 0.1 mm difference in GPU height. Which is actually much bigger issue than it may sound. If that wasn’t enough, there’s also (allegedly) a fourth resin variant strictly for RX Vega 56.