It is somewhat confusing, but it seems by that video that they are now overcompensating by ensuring the vrm area gets an ample amount of clamping force. The pad over the chokes is larger than just the chokes and covers the vrm area too. This seems to point to the fact that the fets always had thermal pads but they were thin, not providing enough pressure. That video bugs me, that guy is touching everything leaving his skin oils all over the place lol.
smh, why they didn't mold some heatsinks into the cooling plate is strange. I suppose they thought that a simple thin plate was enough lol.
What clamping force?
JayzTwoCents and GamersNexus both have videos where they apparently follow EVGA's instructions, and they put the pad on top of the chokes, with nothing touching it on the other side. They then put one on the back of the card between the PCB and backplate. I guess that one accomplishes something, but the one that touches the chokes looks like it's a placebo meant to pacify totally ignorant n00bs.