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Xp-120 INSTALLED PICS....

Moose777

2[H]4U
Joined
Oct 10, 2004
Messages
2,741
So, I spent last night installing my XP-120 and Cooler Master Cool Drive 6 last night.

Here's some pics.

PICT0067.sized.jpg

CPU before I cleaned it. Notice the sectionin the middle with no thermal compound? Nice huh?

PICT0068.sized.jpg

You can actually read the CPU now...all clean. I didn't have any 91% Alcohol so I used 70% alcohol preps. Worked nicely and not as messy as a cotton ball.

PICT0069.sized.jpg

Size comparison between the OEM HSF from AMD and the XP-120 with the Panaflo 120 x 38mm fan. And I think it's time for a new digi cam, mine sucks, I get a black bar on the bottom of all my pictures now. Dunno why.

PICT0070.sized.jpg


PICT0071.sized.jpg

With the mounting plate attatched and the AS5 on the CPU.

PICT0072.sized.jpg

XP-120 installed.

PICT0073.sized.jpg

With the fan mounted.
 
That looks good! How are the temperatures? If I was not watercooling and if I had a A64 Setup, That'd be my choice for a heatsink. :)
 
They are about the same, but I just installed it and haven't used the machine much since installing it.

I'm fixin' to play Punisher right now though so I'll take a look then and let youk now.
 
wow thats alotta wires....i dig that heatpipe heatsink......so there isnt a big change in temp between that and ur stock cooler??? id be pissed after spending $60+ on better cooling.....and btw wats up with that case fan in the back? its frame is broken???
 
Yeah, I ran out of room in my case, I'm hunting for a new case now but I'm finding everythign is about 8" wide I want a case that's 9" wide so I can do some better wire management.

From what I've been hearing it takes a while for the AS5 to activate. It's running cooler but not by much. It's cooler by 7º because it was about 87º with the OEM AMD HSF.

I had to cut the frame on that fan because after I installed my window it wouldn't fit on the case because it was hitting the fan. This was the first case I modded and now that I've got some experience I know I could've gone a different way with it's design but that's why I chose this case cause it was a POS to begin with so it didn't matter if I butchered it. :)
 
87!!?!?!?!?!?!?!?

WTF!?

On stock cooling it shouldn't even have been breaking 55!
 
Gillette said:
87!!?!?!?!?!?!?!?

WTF!?

On stock cooling it shouldn't even have been breaking 55!
thats in farenheit buddy (or at least I hope so)
 
thats a really bad way to apply AS5 IMO. That may be a reason why you didnt see much change.

Apply the paste nice and thin with a razor raelly thing and you may get better temps

You should say your temps in Celcius rather then Fahrenheit, more people know these numbers when dealing with PC temps ;)
 
MaMMa said:
thats a really bad way to apply AS5 IMO. That may be a reason why you didnt see much change.

Apply the paste nice and thin with a razor raelly thing and you may get better temps

You should say your temps in Celcius rather then Fahrenheit, more people know these numbers when dealing with PC temps ;)


but that's the way AS suggested on their site. put a drop in the center and allow the weight of the heatsink to do the job.
 
Meh, I was told to apply it like that. So, I did. The computer is going to come apart after I get my new case anyway so when it does I'll reapply the AS5. :)

And yes, all temps are in farenheit. :)

When I switch to celcius they are around 33º - 35º. :)
 
i assumed you put the paste on the center and just splapped on the HS. :eek:
 
No, not at all. I have that link bookmarked and followed it to the T when I installed my HSF. :)

When I swap everythign over to my new case I'll redo it and see if I notice any changes..
 
Moose777 said:
That's what I followed. :)

I'm gonna do it again in a few weeks anyway. :)


which? the site lists both methods, spreading with thin thing AND putting a blob in the center and using HS weight.
 
Blob in the center. Since I have an AMD CPU I followed the directions for an AMD.
 
thats what your supposed to do....put a drop about the size of 1 1/2 uncoocked grains of rice (he put too much it looks like) and put the HSF on....it fills in all the tiny spots MUCH better than spreading it with a razor.....since it pushed out all the air bubbles

he did it right by just puting a blob in the center and putting the HS on....
 
wow uncooked rice grains, how specific, lol

Thats right down to the damn detail of it. nice one :)
 
thats what AS says...not me.....i just quoted them


dont ask me why they thought of that :confused: :p
 
4b5eN+EE said:
thats what your supposed to do....put a drop about the size of 1 1/2 uncoocked grains of rice (he put too much it looks like) and put the HSF on....it fills in all the tiny spots MUCH better than spreading it with a razor.....since it pushed out all the air bubbles

he did it right by just puting a blob in the center and putting the HS on....
Yeah, I think I put a littel too much on too.

But it's not that hard to clean up. I'll find out when I redo the case though.
 
4b5eN+EE said:
thats what AS says...not me.....i just quoted them


dont ask me why they thought of that :confused: :p

well if your a chink like me, this matters. An uncooked grain of rice is about this long:

------ uncooked
-------- cooked

:)
 
Doesn't it also depend on the size of the core/CPU heatspreader? Like an AMD XP core thats only 1cm sq. almost, and then you got the big ass heatspreaders now these days, so how much you put on now?
 
you use the same amount either way, its just a different application for different applications :p
 
MooCow said:
Doesn't it also depend on the size of the core/CPU heatspreader? Like an AMD XP core thats only 1cm sq. almost, and then you got the big ass heatspreaders now these days, so how much you put on now?


if its the xp core then all u do is fill the core up not the whole heatsink base
 
ok, to clear up some apparent confusion:

for cpu's without a heatspreader, use the razor thin over entire core method.
for lidded cpus, use a very small drop (about the size of a ball bearing is a rough equivilent) in the center of the core. the original poster used about 5x too much :D, which is probably why the temps are amazing yet.. and as5 takes a few days and thermal cycles (on/off) to cure

arctic silver's website says which to do based on the cpu you have. just read it carefully.
i'd recommend against using less than 91% isypropyl alcohol. some have fragrences and stuff that defintly aren't good for thermal transfer.
 
Well I always put on a small amount, and use a credit card to evenly spread it out. I think some places stress a little too much about how to put some damn goop on the CPU... it seems people have many ways to do it right and screw it up. I don't mean to sound rude or anything, but I hate it how it even goes further into "curing" processes and shit. Man, I just put the shit on the CPU, slap the HSF on and use the damn PC!!!

I think as long as you are using some type of compound, you are fine. I once wanted to see how a CPU ran without any thermal compound and it was a huge jump in temps... sounds like a no brainer but yeah that stuff definatly works no matter how bad you put it on, as long as there's some between the CPU and HSF.
 
it's important for smaller cores. i didn't notice too much of an effect with the heatspreader on, but once i took it off things changed a lot. either way, it proves that a few days does effect temps. for those who are too lazy to read the thread:
just for the curious, first time i booted up my computer after lapping....

2.3ghz, 1.57v, ambient = 12c (yeah.. my window was open all the way and it rocked to have the room that cold)
load: 54c
idle: 23c (this is with c&q on)

now, the as5 has settled for the most part..
same cpu specs, 18.5c ambient
load: 40
idle: 22

in the end though, you're right. as long as it's there and it's not coming into contact with other components (a concern when you use excessive amounts of paste), everything will be fine. i'm just including this info because if you purchased an xp-120 for the sake of lower temps, you'll want to get the mount as good as you can ;)
 
(cf)Eclipse said:
it's important for smaller cores. i didn't notice too much of an effect with the heatspreader on, but once i took it off things changed a lot. either way, it proves that a few days does effect temps. for those who are too lazy to read the thread:


in the end though, you're right. as long as it's there and it's not coming into contact with other components (a concern when you use excessive amounts of paste), everything will be fine. i'm just including this info because if you purchased an xp-120 for the sake of lower temps, you'll want to get the mount as good as you can ;)

There are other concerns with using too much paste than just having it come into contact with other components. Thermal paste has much worse thermal transfer properties than the metal of the heatsink, if you use too much and actually get a layer of compound all the way across then you are greatly diminishing the thermal transfer. Metal has many imperfections (this is why lapping to remove these imperfections as much as possible helps temperatures). A normal heatsink will usually make contact on about 3-5% of the actual surface area. Lapping it increases that metal-metal contact. The thermal paste is there merely to fill in the holes. While the thermal paste has much worse thermal transfer properties than metal, it is still much better than air.

Therefore if you have too much goop, and it is getting in the way of the metal-metal contact you would have had it lowers your overall thermal transference. That is why you should never use too much, and why the temps were so bad with that ginormous blob of AS5.
 
(cf)Eclipse said:
ok, to clear up some apparent confusion:

for cpu's without a heatspreader, use the razor thin over entire core method.
for lidded cpus, use a very small drop (about the size of a ball bearing is a rough equivilent) in the center of the core. the original poster used about 5x too much :D, which is probably why the temps are amazing yet.. and as5 takes a few days and thermal cycles (on/off) to cure

arctic silver's website says which to do based on the cpu you have. just read it carefully.
i'd recommend against using less than 91% isypropyl alcohol. some have fragrences and stuff that defintly aren't good for thermal transfer.
I know I did. :D As soon as I took the cap off the tube it started to come out. Damn gravity. lol
 
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