Its not even actually close to the temperature of a fet catching fire...or the board delaminating...or anything even remotely bad really unless its for long sustained times.
Fet heatsinks don't work very well in general because you are placing a thermal pad onto a silicon oxide plastic based component that on its own is a terrible conductor of heat. A better design would sink the heat into the board through the copper layers and use micro-vias to the back of the board and integrate a rear mounted heatsink.
Source: I work as a board rework and development engineer for a large tech company...