Anyone have an opinion? I am getting a shiny new X800PRO from Compusa tommorow, after a failed softmod attempt (just couldnt get the original working properly after). My question is I also bought some new Artic Silver 5 thermal paste. Should I replace the paste which comes with the card? or should I just leave well enough alone if the card overclocks well? Thanks for any advice.
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Thermal Compounds with ATI
- Thread starter SocketA
- Start date
That card probably uses Shin Etsu by default, and AS5 is superior to it, IMHO. You can also try ceramique if you want to be on the safe side, but it probably won't give much of an advantage either way. Gains would be minor and probably not affect overclocking whatsoever, but it depends on how gung ho you are about it. If you feel confident in doing it, then by all means. 
if it's a grey paste that's somewhat thick...then like maxx said...it's probably shin-etsu. most oem's use shin-etsu...including compaq, hp, and dell. I guess they get a good deal on it or something. but it works really well. I used some on my p4 before I switched to ceramique and my temps are the same as they were with shin-etsu.
if it's pink...it's not shin-etsu. shin-etsu looks kind of like concrete mortar actually....
if it's pink...it's not shin-etsu. shin-etsu looks kind of like concrete mortar actually....
Shin Etsu and Arctic Silver both make excellent compounds
Granted I sell Shin Etsu compound, so I may be biased.
IMHO, thermal compounds are rarely applied perfectly by the factories.
Usually they put on too much, or too little and fail to cover the chip surface.
A slightly thicker layer can greatly reduce performance
For example:
A 1.2 mil to 2.0 mil layer of Shin Etsu X23-7783D or G751 will provide low Thermal Resistance... a 3 mil layer will double Thermal Resistance.
http://www.microsi.com/packaging/thermal_grease_x23-7783d.htm
Some people discuss whether AS5 can short video cards, but I suspect its not an issue if applied properly
Arctic Silver cautions:
>>>
Caution:
While much safer than silver greases engineered for high electrical conductivity, Arctic Silver thermal compound should be kept away from electrical traces, pins, and leads. The compound is slightly capacitive and could cause problems if it bridged two close-proximity electrical paths.<<<<
>>>>
Application Instructions
1. Even though Arctic Silver thermal compound is specifically engineered for high electrical resistance, you should keep the compound away from processor, memory, and motherboard traces and pins. There is a possibility that dust or metal particles and/or shavings carried by the airflow inside the computer case could contaminate the compound and increase its electrical conductivity.<<<
I think Shin Etsu G751 or Arctic Silver Ceramique are better choices. If manufacturers are choosing Shin Etsu, I think it is because it is a top performing thermal compound that is reliable long term, and meets the engineering requirements.
AMD is using Shin Etsu , and cautions against phase change materials on larger CPU's.
I think a phase change material like Ceramique can be used if the heat sink is given a twist to break the adhesion .
>>>.Thermal Interface Materials for AMD Opteron and AMD Athlon 64 Processors
AMD evaluates thermal interface materials for use with its AMD Opteron and AMD Athlon 64 processors. A list of suggested materials is provided in the table below.
Suggested Thermal Interface Materials Manufacturer Interface Material Material Type
Bergquist TIC-3000 Grease
Shin Etsu G751 Grease
Shin Etsu X23-7762 Grease
Shin Etsu X23-7783D Grease
Thermoset, Lord CPD TC-350 Grease
The heatsink makes contact with the top surface of the processor package utilizing the thermal interface material between the processor lid and the heatsink. AMD recommends using a high-performance grease such as those listed in the table above. AMD does not recommend using phase-change materials between the heatsink and the processor.
Phase-change materials develop high adhesion forces between the heatsink and processor when the material is in the solid phase. This strong adhesive force may cause the processor to stick to the heatsink. During heatsink removal, this strong adhesive force may cause the processor to be removed from the socket while it is locked, and this action may result in damage to the socket or to the processor pins.
Most grease should be applied in a 34 - 35 mm square that is 0.06 - 0.08 mm thick. This amount of grease has provided good coverage of the processor lid while not being excessive. If excessive amounts are applied, grease may flow over the edges of the processor and reach the socket . This is not desirable.<<<
Granted I sell Shin Etsu compound, so I may be biased.
IMHO, thermal compounds are rarely applied perfectly by the factories.
Usually they put on too much, or too little and fail to cover the chip surface.
A slightly thicker layer can greatly reduce performance
For example:
A 1.2 mil to 2.0 mil layer of Shin Etsu X23-7783D or G751 will provide low Thermal Resistance... a 3 mil layer will double Thermal Resistance.
http://www.microsi.com/packaging/thermal_grease_x23-7783d.htm
Some people discuss whether AS5 can short video cards, but I suspect its not an issue if applied properly
Arctic Silver cautions:
>>>
Caution:
While much safer than silver greases engineered for high electrical conductivity, Arctic Silver thermal compound should be kept away from electrical traces, pins, and leads. The compound is slightly capacitive and could cause problems if it bridged two close-proximity electrical paths.<<<<
>>>>
Application Instructions
1. Even though Arctic Silver thermal compound is specifically engineered for high electrical resistance, you should keep the compound away from processor, memory, and motherboard traces and pins. There is a possibility that dust or metal particles and/or shavings carried by the airflow inside the computer case could contaminate the compound and increase its electrical conductivity.<<<
I think Shin Etsu G751 or Arctic Silver Ceramique are better choices. If manufacturers are choosing Shin Etsu, I think it is because it is a top performing thermal compound that is reliable long term, and meets the engineering requirements.
AMD is using Shin Etsu , and cautions against phase change materials on larger CPU's.
I think a phase change material like Ceramique can be used if the heat sink is given a twist to break the adhesion .
>>>.Thermal Interface Materials for AMD Opteron and AMD Athlon 64 Processors
AMD evaluates thermal interface materials for use with its AMD Opteron and AMD Athlon 64 processors. A list of suggested materials is provided in the table below.
Suggested Thermal Interface Materials Manufacturer Interface Material Material Type
Bergquist TIC-3000 Grease
Shin Etsu G751 Grease
Shin Etsu X23-7762 Grease
Shin Etsu X23-7783D Grease
Thermoset, Lord CPD TC-350 Grease
The heatsink makes contact with the top surface of the processor package utilizing the thermal interface material between the processor lid and the heatsink. AMD recommends using a high-performance grease such as those listed in the table above. AMD does not recommend using phase-change materials between the heatsink and the processor.
Phase-change materials develop high adhesion forces between the heatsink and processor when the material is in the solid phase. This strong adhesive force may cause the processor to stick to the heatsink. During heatsink removal, this strong adhesive force may cause the processor to be removed from the socket while it is locked, and this action may result in damage to the socket or to the processor pins.
Most grease should be applied in a 34 - 35 mm square that is 0.06 - 0.08 mm thick. This amount of grease has provided good coverage of the processor lid while not being excessive. If excessive amounts are applied, grease may flow over the edges of the processor and reach the socket . This is not desirable.<<<