Ok so I have another thread where I have been battling some slightly higher temps than I was hoping for on my watercooling setup. Ill give the cliffnotes version of the specs.
AMD 965BE @ 4.1ghz
GTX580 Reference @ 900mhz /1.1v
EK Copper/Acetal GPU Block
XSPC Raystorm CPU Block
Swiftech Extreme MCR320 Radiator (20fpi)
EK 4.0 800lph pump
Swiftech Micro Res with Fill and Drain ports installed
My temps on my CPU have been idling at 34*c and Loading at 48-50*c
My temps on my GPU have been idling at 30-33*c and loading at 54-60*c depending on ambient temps. Ambient temps are usually in the low 70s in winter and upper 70s in the summer.
People are telling me that my temps are too high and Im going to double check my TIM applications later today, but last night I got to thinking about my Switch 810. Right now I have the fans mounted on the inside of the case at the top pulling air through the radiator and out the top of the case. However since the switch 810 has roughly a 2" gap between the fan mout and the top cover of the case, plus the added restriction of the louvers (even when they are open) I noticed that its acting like a hot box... the hot air seems to just sit in there which I believe to be causing my temps to climb.
Here are some pics for those who dont know what I mean.
Notice the gap between the fan and the top of the case, most noticable at the far side of the pic.
Here is another good pic showing the gap between the top of the case and the top cover (this pic has louvers closed) when the fans are mounted on the inside of the case rather than on top of the case.
Here is my setup
Here is what I need advice on.
1. Should I mount the fans on the top of the case, and the radiator under the top of the case basically sandwiching the case between the fans and radiator? To me that seems like it will have a gap around the radiator which would promote air being pulled in from the sides rather than through the radiator, so I would install some sort of seal or gasket to make sure the air passes through the radiator.
2. Should I reverse the fans and pull air in from the top of the case rather than exhausting it and arrange my case fans accordingly for proper pressure equalization?
I know that I dont have air in my system so I dont believe that to be the issue. After feeling how HOT it was around the radiator i believe it to be a poor design at the top of the case when the radiator and fans are mounted inside leading to a heat soak issue where the hot air cant get out.
I did however remove the side of the case and the top louvers and noticed a decrease in temps, but still not as low as I was expecting to see. I only saw maybe a 2-3*c drop, which is why I am going to also focus my attention on the TIM.
Ideas, suggestions on the case/fan/radiator setup?
AMD 965BE @ 4.1ghz
GTX580 Reference @ 900mhz /1.1v
EK Copper/Acetal GPU Block
XSPC Raystorm CPU Block
Swiftech Extreme MCR320 Radiator (20fpi)
EK 4.0 800lph pump
Swiftech Micro Res with Fill and Drain ports installed
My temps on my CPU have been idling at 34*c and Loading at 48-50*c
My temps on my GPU have been idling at 30-33*c and loading at 54-60*c depending on ambient temps. Ambient temps are usually in the low 70s in winter and upper 70s in the summer.
People are telling me that my temps are too high and Im going to double check my TIM applications later today, but last night I got to thinking about my Switch 810. Right now I have the fans mounted on the inside of the case at the top pulling air through the radiator and out the top of the case. However since the switch 810 has roughly a 2" gap between the fan mout and the top cover of the case, plus the added restriction of the louvers (even when they are open) I noticed that its acting like a hot box... the hot air seems to just sit in there which I believe to be causing my temps to climb.
Here are some pics for those who dont know what I mean.
Notice the gap between the fan and the top of the case, most noticable at the far side of the pic.
Here is another good pic showing the gap between the top of the case and the top cover (this pic has louvers closed) when the fans are mounted on the inside of the case rather than on top of the case.
Here is my setup
Here is what I need advice on.
1. Should I mount the fans on the top of the case, and the radiator under the top of the case basically sandwiching the case between the fans and radiator? To me that seems like it will have a gap around the radiator which would promote air being pulled in from the sides rather than through the radiator, so I would install some sort of seal or gasket to make sure the air passes through the radiator.
2. Should I reverse the fans and pull air in from the top of the case rather than exhausting it and arrange my case fans accordingly for proper pressure equalization?
I know that I dont have air in my system so I dont believe that to be the issue. After feeling how HOT it was around the radiator i believe it to be a poor design at the top of the case when the radiator and fans are mounted inside leading to a heat soak issue where the hot air cant get out.
I did however remove the side of the case and the top louvers and noticed a decrease in temps, but still not as low as I was expecting to see. I only saw maybe a 2-3*c drop, which is why I am going to also focus my attention on the TIM.
Ideas, suggestions on the case/fan/radiator setup?
