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Stacking TECs?

mwin

mwin

2[H]4U
Joined
Jun 24, 2004
Messages
3,625
Anybody done it? Is it that much better than a single? Any info/opinions welcome.
 
gclg2000 said:
It can be done.
Click to expand...

The success rate is also measured by how willing and comfortable you are with modifying that type of hardware, but I guess that can be said about any aspect of computers.
 
Does anybody have any links to stacked TEC builds? Tips and pointers?
 
Well years and years ago when whole TEC madness started there where few Companies selling stacked up TECs.
Though some of them used like smaller TEC cooling big one!!??
TEC is a thermal pump hence it doesn't produce coldness as just pumps efectivly heat to the other side.If the hot sided isn't good cooled it will have no effect.Cooling on hot side has to be able to cool source heat disipation and TEC hot side heat disipation.Hence other way arround big TEC cooling smaller one and source works better (using plus on black wire and minus on red wire will do the trick though)
TEC sides are ceramic hence conection between them aint ideal hence coper plate between would doo better job.
Then one should ask him self if it's a pump why helping smaller pump pumping with bigger pump?Is a smaller pump bottle neck for a big pump and does a big pump it self pumps better stand alone?
Well single TEC can make only so much temperature difference between two plates. Hence two stacked up TECs if cooled proper can make more temp. difference / lower temps.

But then again modern OC processor can produce 150+ watt heat. Cooled with 226 Watt TEC it will result in hot plate wich delivers 376watt heat. To cool that You will need min 400 watt TEC(or two 226 watt). And hot plate of that TEC will need to be cooled with 800+ watt!!??? Well that can be cooled with car radiator. You will also need PSU to power 650 watt TECs and isolation and ...Well Vaporfasechange cooling is better option then IMHO.

Assambly should be like cold plate 226 Watt TEC then double size thicker cold plate with two 226 watt TECs and then hotplate. That should be very tight screwed together in ideal situation with non conductive bolts. Then there should be nice huge waterblock also tight connected to hot plate or costum hotplate / water jacked should be made.
Isolation could be a problem though.
It's been done though I have no links anymore (for a long time I wasn't active in this part of a forum).

So more sane / practical soulution is a single TEC good cooled on hot side.
If existing setup aint cuting it anymore then IMO it's better to change to bigger TEc then to cool existing TEC with second one.

I could imagine though that someone comes on idea to strap smaller TEC on top of a water block and cool that one with secondary loop.In that configuration Primar TEC hot plate cooling would be still a water and secondary cooling would be second TEC. Only on such setups effciency aint that great hence difference is not so great exept if one would use huge secondary TEC.



MD
 
it used to be done quite often, but while the temperature differential is incresed the sheer amount of heat you add by doing it complicates its eventaual removal as pointed out
it fell out of favor because of the ease of competeing technologies that where simpler and more reliable (chip chillers ect)

when a TEC goes wrong it all goes to hell in a handbasket very very quickly
 
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