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Reusing thermal pads...

R

rush24t3

2[H]4U
Joined
Jun 1, 2004
Messages
2,540
If you used the stock HSF and thermal pad the first time you put your CPU in, and later want to move the CPU to a newer board, can you "reuse" the thermal pad and get somewhat similar temps to when it was out of the box new?
 
there is a small chance you will get awaywith it for a short time but it isnt woth the risk
 
no, the temps will be much higher, and besides, you shouldn't use thermal pads anyhow.. of all TIM's, thermal pads are the worst ;)

as a side note, i doubt you can get the pad off in one piece if it's already been used
 
Torquemada XP said:
If you used the stock HSF and thermal pad the first time you put your CPU in, and later want to move the CPU to a newer board, can you "reuse" the thermal pad and get somewhat similar temps to when it was out of the box new?
Click to expand...
The answer is: No. :(
Most likely, the old thermal pad will be mangled enough to be rendered totally unusable when you remove the HSF from the CPU (which you must do just to get at the locking mechanism for the CPU socket).

By the way, AMD recommends only thermal pads when you mount a HSF to a lidless CPU, such as the AthlonXP. AMD does not recommend thermal pastes or thermal compounds with lidless CPUs except for testing purposes. On the other hand, some newer AMD CPUs have their own heat spreader lids. In this case, then DO NOT USE thermal pads. Use only thermal paste or a non-conductive thermal compound with a lidded CPU.
 
E4g1e said:
The answer is: No. :(
Most likely, the old thermal pad will be mangled enough to be rendered totally unusable when you remove the HSF from the CPU (which you must do just to get at the locking mechanism for the CPU socket).

By the way, AMD recommends only thermal pads when you mount a HSF to a lidless CPU, such as the AthlonXP. AMD does not recommend thermal pastes or thermal compounds with lidless CPUs except for testing purposes. On the other hand, some newer AMD CPUs have their own heat spreader lids. In this case, then DO NOT USE thermal pads. Use only thermal paste or a non-conductive thermal compound with a lidded CPU.
Click to expand...

That's odd considering OEM A64's come with Thermal pads on their heatsink.


And let me be the first person here to say yes it's okay to do it on a regular non-o/c'ed system. It will raise the temp maybe 4-5c which is substancial, but also with in tolerances.

So do it if you don't care (like for my wifes computer), but if care take the time to scrape it off and use a nice little dollup of paste.
 
obiwansotti said:
That's odd considering OEM A64's come with Thermal pads on their heatsink.
Click to expand...

Is it even more odd that OEM a64s dont come with heatsinks?
 
obiwansotti said:
That's odd considering OEM A64's come with Thermal pads on their heatsink.
Click to expand...
Actually, that's not a thermal pad per se. The OEM heatsink on lidded CPUs (like the A64) is completely different from the phase-change thermal pad that sticks to a non-lidded CPU (like the AXP). The A64's pad does not stick to the lid, though parts of the black material may rub off on the corners.
 
E4g1e said:
Actually, that's not a thermal pad per se. The OEM heatsink on lidded CPUs (like the A64) is completely different from the phase-change thermal pad that sticks to a non-lidded CPU (like the AXP). The A64's pad does not stick to the lid, though parts of the black material may rub off on the corners.
Click to expand...
But would it be all right as a temporary solution (like a few days)?
 
(cf)Eclipse said:
no, the temps will be much higher, and besides, you shouldn't use thermal pads anyhow.. of all TIM's, thermal pads are the worst ;)

as a side note, i doubt you can get the pad off in one piece if it's already been used
Click to expand...
because i'm lazy :p
 
radioshack? or some other local hardware store?
if you want, you can lap the heatspreader (assuming a64) and the heatsink and go without thermal paste until you can get some. it'll help temps out in the end anyhow :D
 
Moderate lapping lapping w/ thermal paste is a very good option also. Despite common opinion, you don't have to go crazy with the lapping. Go up to 400 grit for 3 min on a good piece of flat glass, and you'll be cool. You're simply trying to get the surface of the heatsink flat enough to mate with the processor surface. A razor thin application of thermal compound will take care of the remaining roughness.
 
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