- Joined
- Dec 17, 2007
- Messages
- 1,697
So making this quick so i can get a quick answer. 6 months ago i built PC in my sig, when putting HSF onto cpu, i put HSF on there (with stock intel HSF and stock thermal pad) and tightened the screws, came back and forgot if i tightened them, so i turned them, and they became loose. So the CPU and HSF werent touching anymore, i put it back and tightened and have used it since. It has had no heat issues or anything, but now that im getting into OC'ing (at 3.3ghz so far), i want to be positive my HSF is correctly applied.
So i have Artic Silver 5 and know to scrape (gentley) the pad from the HSF and CPU, with something plastic like a credit card. Then use 90% or more rubbing alchohal on a Qtip and apply that to both. Then apply the AS5 how the AS website says how to.
So first i am just double checking, how i said to do it, is correct right? And second, considering iv been told "the original thermal pad filled in the microscopic pits in the heatsink base", will this all be for nothing? Or is it still smart anyways to apply AS5?
So i have Artic Silver 5 and know to scrape (gentley) the pad from the HSF and CPU, with something plastic like a credit card. Then use 90% or more rubbing alchohal on a Qtip and apply that to both. Then apply the AS5 how the AS website says how to.
So first i am just double checking, how i said to do it, is correct right? And second, considering iv been told "the original thermal pad filled in the microscopic pits in the heatsink base", will this all be for nothing? Or is it still smart anyways to apply AS5?