Parja
[H]F Junkie
- Joined
- Oct 4, 2002
- Messages
- 12,671
Got my Q6600 G0 fired up last night and after determining everything was running ok, headed straight for 9x333 @1.35V to get started on OCing this beast. Seems stable with Prime95 v25.4 so far, but per CoreTemp v.95, I'm seeing a pretty significant difference in core temperatures.
Cores 0 and 3 are stable at around 52C under full load while cores 1 and 2 are stable at around 44C...so about an 8C difference.
Are others seeing this kind of variation as well? It seems odd that 0/3 and 1/2 would have similar temps since the logical configuration would be 0 and 1 being on one die and 2 and 3 being on the other.
I applied AS5 with the line across the heatspreader in the orientation indicated on the AS website, so I think my technique was solid, but it's got me wondering.
Also, does anyone know the location of each specific die on the chip? If I pull my heatsink off, I'd like to be able to logically correlate the paste pattern and heatsink orientation back to the temps I was getting.
Cores 0 and 3 are stable at around 52C under full load while cores 1 and 2 are stable at around 44C...so about an 8C difference.
Are others seeing this kind of variation as well? It seems odd that 0/3 and 1/2 would have similar temps since the logical configuration would be 0 and 1 being on one die and 2 and 3 being on the other.
I applied AS5 with the line across the heatspreader in the orientation indicated on the AS website, so I think my technique was solid, but it's got me wondering.
Also, does anyone know the location of each specific die on the chip? If I pull my heatsink off, I'd like to be able to logically correlate the paste pattern and heatsink orientation back to the temps I was getting.