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Proper TIM application? (nanotherm pcm)

T

tristam

Limp Gawd
Joined
Dec 21, 2003
Messages
141
I'm sorry, but i need PICS!!!, i cant tell how much a "thin, even layer" is with just words...

am i supposed to still see the heat spreader under the goo (i.e. should it be thick enough that i can't exactly see through it)?

is it supposed to be ridiculously thin and almost not there?

Am i supposed to put the same amount on the HSF as i did on the chip?

etc. etc.

I am really confused, and i would like some help because i've applied it twice now, and i still am getting really high temps...(A64 3000+ (~39C idle, load = ??C (i've seen 48, 55, even 66 (<--AIDA32 while Prime95-ing))

Please help.
 
tristam said:
I'm sorry, but i need PICS!!!, i cant tell how much a "thin, even layer" is with just words...

am i supposed to still see the heat spreader under the goo (i.e. should it be thick enough that i can't exactly see through it)?

is it supposed to be ridiculously thin and almost not there?

Am i supposed to put the same amount on the HSF as i did on the chip?

etc. etc.

I am really confused, and i would like some help because i've applied it twice now, and i still am getting really high temps...(A64 3000+ (~39C idle, load = ??C (i've seen 48, 55, even 66 (<--AIDA32 while Prime95-ing))

Please help.
Click to expand...

Here's a link to a recent review of the Nanotherm PCM+ Aqua with pics that might help: http://www.xyzcomputing.com/index.php?option=content&task=view&id=79&Itemid=2.

Since the PCM+ Aqua is a liquid, the application of the TIM is very simple. Here is the suggested application method:
- Clean both heat transfer surfaces thoroughly with a good cleaner (i.e. - 90+ % isopropyl alcohol) and then wipe with lint-free cloth.
- Put a small drop of PCM+ Aqua on both contact surfaces (one at a time) and spread a relatively thin (.001 - .002") and even coating (with the supplied finger cot) across the mating contact areas on both surfaces. FYI - one drop is enough to cover roughly 2.5 - 3 sq. in. of surface area. Any excess TIM will get squeezed out of the thermal junction by the clamp pressure of the cooling device after assembly.
- Once the PCM+ Aqua begins to "haze" around the edges and starts to solidify after about 2 - 3 minutes, then carefully assemble the HSF / Waterblock to your CPU.
 
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