Plz read: Thermal paste

[SkyHi]

I just got my AMD 64 3200+ and it came with some white stuff on the heatsink, is that the thermal paste? if so is it enough?

 

[TSS Modder]

yes, thats a thermal pad. no it wont do much. cleaning that w/ some rubbing alcohol and applying some arctic silver 5 will give you much better results.

 

[lithium726]

yes, thats a thermal pad. no it wont do much. cleaning that w/ some rubbing alcohol and applying some arctic silver 5 will give you much better results.

the TIM AMD puts on the retail HSF's for a64's is shin etsu. its on par or better than as5. if you are just using stock cooling, you cant go wrong with it.

 

[Brando457]

as5 isnt that great, i had it on my cpu and it freaking glued the heatsink to the cpu

 

[lithium726]

as5 isnt that great, i had it on my cpu and it freaking glued the heatsink to the cpu

how do you figure that has anything to do with how good AS5 is, when it sounds like you just put too much on there?

 

[IceWindus]

as5 isnt that great, i had it on my cpu and it freaking glued the heatsink to the cpu

Uh, thats what its designed to do. Its molecular structure changes as the heat bonds the CPU and HSF together to form a much better thermal transfer.

 

[BillR]

as5 isnt that great, i had it on my cpu and it freaking glued the heatsink to the cpu

Aside from all of the above it also means your heatsink and cpu surface are actually flat. That's the way it should be.

AS-5 is great if and only if you go to the web site and follow the easy to read instructions, which judging from all the posts almost no one does

 

[gigglebyte]

we are [H]ARD...we don't need to read the stinking directions!!!

 

[TSS Modder]

we are [H]ARD...we don't need to read the stinking directions!!!

amen.

 

[(cf)Eclipse]

WOW, go misinformation.

first, i see waaaayyyy too many people not read the directions and apply thermal paste wrong. it's the one thing you should do right. to settle any controversy now, i have tested.
blob > spread
(read: AS's instructions are the best way to go. which makes sense, seeing as they're the ones who make the stuff)

icewind: no, you're thinking of a phase change pad. as5 doesn't harden, it's not supposed to. what happens is the surface area is so large and the paste is so viscous. think of how when you get peanut butter on your fingers and squish them together, there is resistance when you pull them apart. the same exact thing happens between the heatsink and heatspreader, just
on a greater (but less yummy) scale

 

[ashmedai]

Uh, thats what its designed to do. Its molecular structure changes as the heat bonds the CPU and HSF together to form a much better thermal transfer.

I was thinking he was thinking of thermal adhesive which, while also being available from AS, is not a good idea to put on a CPU in most cases.

 

[n64man120]

blob > spread

idk, i've tried both several times and spread always seems to work better and give me slightly better temps. Maybe I'm just a good spreader, who knows. My blobs form a circle, as most do i'd presume... and dont cover a decent chunk of the heatsink.

 

[lithium726]

idk, i've tried both several times and spread always seems to work better and give me slightly better temps. Maybe I'm just a good spreader, who knows. My blobs form a circle, as most do i'd presume... and dont cover a decent chunk of the heatsink.

most heat is concentrated right when the core contacts the IHS, so covering the IHS doesnt really do anything for temps... the IHS is there to keep you from cracking hte core, not to lower temps

 

[(cf)Eclipse]

also, how big was your blob? small is best.. preferably very small. if you can lap the ihs and heatsink, that would be optimal without removing the heatspreader.

 

[Fark_Maniac]

WOW, go misinformation.

first, i see waaaayyyy too many people not read the directions and apply thermal paste wrong. it's the one thing you should do right. to settle any controversy now, i have tested.
blob > spread
(read: AS's instructions are the best way to go. which makes sense, seeing as they're the ones who make the stuff)

icewind: no, you're thinking of a phase change pad. as5 doesn't harden, it's not supposed to. what happens is the surface area is so large and the paste is so viscous. think of how when you get peanut butter on your fingers and squish them together, there is resistance when you pull them apart. the same exact thing happens between the heatsink and heatspreader, just
on a greater (but less yummy) scale

this is exactly right....what makes the two surfaces bond is the lack of air inbetween the two surfaces. The same effect can happen if you take two heatsinks...lap them as flat and as smooth as you possibly can....stick the surfaces together as hard as you can and they will bond together enough to hold them horizontally and the 2nd heatsink will not fall for a period of time.
Why does your boot feel like it is stuck in the mud if you submerge your foot in it...is the mud adhesive? nope...just no air to replace the mud...thus it is hard to bring your foot out. put a soft pipe under there and you can bring your foot right out.

 

[Abunai]

Hey can anyone explain to me why in the Artic Silver instructions it says for AS 1, 2, and 3 they recommend a sort of "Spread and Clean" preperation before applying, whereas in step 7 (noted as being for ALL AS versions) they get right to the blob, plop and twist method without the forplay. I dont know if Im misreading it but the gist Im getting is AS5 does not need to have the heatsink "prepped" to fill in the microscopic valleys whereas AS 1,2 and 3 do. Is that true?

Skip to step 4...
http://www.articsilver.com/arctic_silver_instructions_big2.htm

 

[XeroHouR]

when i pulled my waterblock off my prescott after 6 months of load and unload and overclock and heat...I noticed the socket was empty, but the lever was down. Looked at the block and the CPU was stuck to the block. Thats a terrifying sight especially when the lever is still locked(<--- to reinfoce the level WAS LOCKED). I thought I lost my 3.2E

edit:im stupid, this was using AS5, thats how this relates lol

 

[ashmedai]

The locking lever is designed to keep it from falling off, which doesn't really require much of a grip. It happens sometimes.

 

[Optik]

Hey can anyone explain to me why in the Artic Silver instructions it says for AS 1, 2, and 3 they recommend a sort of "Spread and Clean" preperation before applying, whereas in step 7 (noted as being for ALL AS versions) they get right to the blob, plop and twist method without the forplay. I dont know if Im misreading it but the gist Im getting is AS5 does not need to have the heatsink "prepped" to fill in the microscopic valleys whereas AS 1,2 and 3 do. Is that true?

Skip to step 4...
http://www.articsilver.com/arctic_silver_instructions_big2.htm

IF you want to follow their instructions, then yes, no need to apply as5 like that. if you've never applied thermal paste yet, be warned, (esp as5/ceramique) that it is VERY thick. i guess the best analagy i could give you is its like very very stiff honey from a jar

 

[BillR]

when i pulled my waterblock off my prescott after 6 months of load and unload and overclock and heat...I noticed the socket was empty, but the lever was down. Looked at the block and the CPU was stuck to the block. Thats a terrifying sight especially when the lever is still locked(<--- to reinfoce the level WAS LOCKED). I thought I lost my 3.2E

edit:im stupid, this was using AS5, thats how this relates lol

If you take a small screwdriver and “GENLTY” lift the HSF at a CORNER they will separate properly. Don’t pry it hard or fast, just gentle steady pressure.

 

[(cf)Eclipse]

i prefer the twist while lifting method. seems safer from some reason.

 

[Abunai]

IF you want to follow their instructions, then yes, no need to apply as5 like that. if you've never applied thermal paste yet, be warned, (esp as5/ceramique) that it is VERY thick. i guess the best analagy i could give you is its like very very stiff honey from a jar

I used Ceramique before on a couple GPU heatsinks but this'll be my first time messing with AS5. I just wanted to make sure I wasn't going to make a mistake by skipping steps 4-6 with the as5.