Greetings,
I am looking for a particular HardOCP article that was dedicated to specifically testing the difference between using a pea/rice-size drop of thermal paste on the center of a die vs even spreading. I am having difficulty finding this article using the search functions.
I am looking for a particular HardOCP article that was dedicated to specifically testing the difference between using a pea/rice-size drop of thermal paste on the center of a die vs even spreading. I am having difficulty finding this article using the search functions.