It seems like as the technology improves, there's less need for taking extra measures just for cooling. I mean think about it:
1. Northbridge was removed entirely for intel systems because it's now in the CPU
2. Southbridge rarely needs more than a thin heat spreader
3. RAM doesn't need more than a small heatspreader, even when overclocking
4. CPU's have come a long ways with respect to TDP as manufacturing sizes have shrunk drastically (remember the toaster someone made out of old AMD chips?)
5. mainstream GPU's are even pretty good, especially the latest generation nVidia ones. Yes, the enthusiast cards still put out some heat, and AMD moreso than nVidia. But that's the direction we're heading there too.
I just remember the days when getting your case airflow to be flawless was crucial to keeping a system running 24/7. Nowadays you can just buy run-of-the-mill components and you'll have a system that runs at decent temps. No more water cooling every component on a mobo, special components to eject heat from the case, special case configurations to get cooling where it's needed.
Arguably the latter is becoming more standard, so perhaps that has something to do with it. But it just doesn't seem to be as big a deal today as it did 5 or 10 years ago.
Discuss.
1. Northbridge was removed entirely for intel systems because it's now in the CPU
2. Southbridge rarely needs more than a thin heat spreader
3. RAM doesn't need more than a small heatspreader, even when overclocking
4. CPU's have come a long ways with respect to TDP as manufacturing sizes have shrunk drastically (remember the toaster someone made out of old AMD chips?)
5. mainstream GPU's are even pretty good, especially the latest generation nVidia ones. Yes, the enthusiast cards still put out some heat, and AMD moreso than nVidia. But that's the direction we're heading there too.
I just remember the days when getting your case airflow to be flawless was crucial to keeping a system running 24/7. Nowadays you can just buy run-of-the-mill components and you'll have a system that runs at decent temps. No more water cooling every component on a mobo, special components to eject heat from the case, special case configurations to get cooling where it's needed.
Arguably the latter is becoming more standard, so perhaps that has something to do with it. But it just doesn't seem to be as big a deal today as it did 5 or 10 years ago.
Discuss.