I remember hearing reports that zen will be a modular cpu
Leaked details, if true, point to potent AMD Zen CPU | ExtremeTech
But what about a modular gpu from amd? Not just slapping two gpus on a single card like they do with x2 parts where it is still treated as two separate gpus, I am talking about a design where smaller gpu dies can be placed onto a card in such a way that they behave like a single larger die gpu.
Imagine a polaris 10 part with a 232 die size, but combining three or 4 of them and getting the scaling as a single gpu with three to four times the performance.
What is it that prevents this from happening? latency between the different gpu dies? Not being able to share the same memory pool? Is there a way so solve that?
Why not have a design with 8GB or some advanced memory that 2-4 gpus could all connect to and access? What about those optical interconnects that were talked about?
Not applicable on gpus? They keep talking about lower yields on a new process and focusing on smaller die sizes, but this modular approach would allow smaller die sizes to just connect up in some sort of megazord like monster... but is that not possible to do?
Leaked details, if true, point to potent AMD Zen CPU | ExtremeTech
But what about a modular gpu from amd? Not just slapping two gpus on a single card like they do with x2 parts where it is still treated as two separate gpus, I am talking about a design where smaller gpu dies can be placed onto a card in such a way that they behave like a single larger die gpu.
Imagine a polaris 10 part with a 232 die size, but combining three or 4 of them and getting the scaling as a single gpu with three to four times the performance.
What is it that prevents this from happening? latency between the different gpu dies? Not being able to share the same memory pool? Is there a way so solve that?
Why not have a design with 8GB or some advanced memory that 2-4 gpus could all connect to and access? What about those optical interconnects that were talked about?
Not applicable on gpus? They keep talking about lower yields on a new process and focusing on smaller die sizes, but this modular approach would allow smaller die sizes to just connect up in some sort of megazord like monster... but is that not possible to do?