IBM says they have developed a way to stack chips vertically that speeds data transfer and can be used in products ranging from cell phones to supercomputers.
The vertical connections are referred to as "through-silicon-vias," which allow multiple chips to be stacked together with greater information flow between them. IBM said its three-dimensional approach creates the possibility of up to 100 times more pathways for information, and shortens by 1,000 times the distance that information on a chip needs to travel.
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