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Maybe only Intel knows this, but I'm curious how it works on say the Core 2 Duo line.
In the old days I think chips would get binned cause some of the transistors didn't yield, but in a modern fab do they still do that?
Does an e5200 come off the same wafer or same fab line as an e8600? Seems unlikely since I think they have some architecture differences, but what about e8400 and e8600, are those off the same wafer and just binned according to electrical testing?
If the e5200 is not off the same wafer or line, how do they end up with lower OC performance - if the yield or process is the same, I'd think the e5200 would overclock just as well as an e8400.
In the old days I think chips would get binned cause some of the transistors didn't yield, but in a modern fab do they still do that?
Does an e5200 come off the same wafer or same fab line as an e8600? Seems unlikely since I think they have some architecture differences, but what about e8400 and e8600, are those off the same wafer and just binned according to electrical testing?
If the e5200 is not off the same wafer or line, how do they end up with lower OC performance - if the yield or process is the same, I'd think the e5200 would overclock just as well as an e8400.