RancidWAnnaRIot
EspantaPajaros
- Joined
- Feb 19, 2004
- Messages
- 11,033
So i was reading the june 2004 issue of IEEE spectrum (any IEEE member gets the mag). There is an article on CPU cooling and the future of it... interesting stuff. According to Patrick P. Gelsinger the CTO of intel, if more fiery chips are to continue to be made unchecked, we could be seeing CPUs that generate as much heat as the sun in a decade (10,000 W/cm^3) .
So you ask.. what's being done about this?
There is some crazy stuff in this article, i will only touch lightly on them.. i would suggest you guys go out and find this issue if you want to read more.
Hewlett-packard showed off recently a new cooling system. it's called MEMS, basically it's a liquid cooling unit that sits on the chip, and sprays this liquid on the chip. the boiling point of the liquid is 56 C, and i believe it's a florine-based dielectric fluid. According to the mag, they can remove 300 to 400 Watts per square centimeter with the current prototype. And that's all locally on the chip. Also they say if they spread the heat more with conductive plates they could actually dissipate twice that number.
Also, there is some lady at some Univ. in NY that is developing a thermal grease that's a polyethylene glycol water soluble solution used in things like tooth paste and printer ink. Apparently it fills the micro crannys on both the heat sink and cpu die very well. The lady say's that most peopel think the best way to go is to make a compound that is highly heat conductive, but she found that something that is more spreadable works best. Apparently this stuff works better than any thermal goop that's out now. Artic silver watch out!!
So yeah.. what do you guys think.. i think everyone should read this article for themselves... i only touched a few things.
So you ask.. what's being done about this?
There is some crazy stuff in this article, i will only touch lightly on them.. i would suggest you guys go out and find this issue if you want to read more.
Hewlett-packard showed off recently a new cooling system. it's called MEMS, basically it's a liquid cooling unit that sits on the chip, and sprays this liquid on the chip. the boiling point of the liquid is 56 C, and i believe it's a florine-based dielectric fluid. According to the mag, they can remove 300 to 400 Watts per square centimeter with the current prototype. And that's all locally on the chip. Also they say if they spread the heat more with conductive plates they could actually dissipate twice that number.
Also, there is some lady at some Univ. in NY that is developing a thermal grease that's a polyethylene glycol water soluble solution used in things like tooth paste and printer ink. Apparently it fills the micro crannys on both the heat sink and cpu die very well. The lady say's that most peopel think the best way to go is to make a compound that is highly heat conductive, but she found that something that is more spreadable works best. Apparently this stuff works better than any thermal goop that's out now. Artic silver watch out!!
So yeah.. what do you guys think.. i think everyone should read this article for themselves... i only touched a few things.