Ive had my water cooling for about half a year now and I have my heatercore placed in the front. Anyways after viewing a bunch of galleries I noticed that a lot of people have their heatercores mounted on the inside top of the case. My question is.. does mounting it there decrease the performance compared to if it is mounted in the front?
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Heatercore placement questions
- Thread starter osirus35
- Start date
Ice Czar
Inscrutable
- Joined
- Jul 8, 2001
- Messages
- 27,174
assuming your drawing air through the rad and into the case, you have a better temperature differential to transfer heat from the rad to the air, but your dumping that heat into the case
whereas if your at the top your preheating the air with assorted heatsources from the mobo (VRMs, drives ect) lowering the temperature differential for heat transfer from the rad, but your dumping it outside the case
the best case solution is the strengths of each, where the rad has both a cool airstream from outside the case and dumps it outside the case, meaning its seperate from the mobo compartments airflow pattern and exhaust
actual performance of all those varies with the number of heatsources and the particular components (some boards have hotter VRM-Voltage Regulation Moduals to support more power hungry processors, some configs hav alot of drives and cards with their added heat)
some configs the 1st or second solution is acceptable, but eventually its the starting ambient room temperature that matters at the top end, some solutions may become marginal if that increases too much
perfect being the ability to cool the CPU to near room ambient and the interior case temperature to room ambient
but if the room ambient is higher that gets harder and harder
whereas if your at the top your preheating the air with assorted heatsources from the mobo (VRMs, drives ect) lowering the temperature differential for heat transfer from the rad, but your dumping it outside the case
the best case solution is the strengths of each, where the rad has both a cool airstream from outside the case and dumps it outside the case, meaning its seperate from the mobo compartments airflow pattern and exhaust
actual performance of all those varies with the number of heatsources and the particular components (some boards have hotter VRM-Voltage Regulation Moduals to support more power hungry processors, some configs hav alot of drives and cards with their added heat)
some configs the 1st or second solution is acceptable, but eventually its the starting ambient room temperature that matters at the top end, some solutions may become marginal if that increases too much
perfect being the ability to cool the CPU to near room ambient and the interior case temperature to room ambient
but if the room ambient is higher that gets harder and harder