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Gaming Benchmarks Reveal AMD AGESA 1.2.0.2b Patch Brings Slightly Better Gaming Performance On Ryzen CPUs

erek

erek

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Local reference:
ASUS Intros “Core Tuning Config For Gaming” Feature In AM5 BIOS, Reduces Overall System Latency For Faster Performance On Ryzen CPUs
Replies 5
Saturday at 8:40 PM

“As mentioned in the results, this was achieved via BIOS 3065 Beta, which isn't yet official. Currently, you can only download the BIOS 3057 for this particular model, which comes with the AGESA 1.2.0.2a patch. However, the latest one should come out in a few days. One more thing to point out here is that the 1.2.0.2b patch shows improved memory latency as tested by the user in AIDA64 Extreme. As mentioned in the intro, the memory latency decreased to 64 ns from over 68 ns. This is similar to pre-AGESA 1.2.0.2a patch latency.

News Source: Compusemble”

Source: https://wccftech.com/amd-agesa-1-2-0-2b-patch-better-gaming-performance-on-ryzen-cpus/
 
Any idea what specifically was changed here?

Sounds odd to have a BIOS change effect... this whatever it is.
 
Sounds good.

If I try to set my memory above 5200, as things are, the system locks and I have to open the case and pull out the GPU to do a cmos reset.

Can you buy a cable with a button for that?

Maybe this will help?
 
Elf_Boy said:
Sounds good.

If I try to set my memory above 5200, as things are, the system locks and I have to open the case and pull out the GPU to do a cmos reset.

Can you buy a cable with a button for that?

Maybe this will help?
Click to expand...

Depends... Does your board have pin headers to short? You can harvest an old power/reset case switch and plug it into those headers. If you've got one of the boards where they put a button on the board rather than headers, it's harder.
 
toast0 said:
Depends... Does your board have pin headers to short? You can harvest an old power/reset case switch and plug it into those headers. If you've got one of the boards where they put a button on the board rather than headers, it's harder.
Click to expand...

Pin headers. Part of what makes it such a pita to get at them.
 
Elf_Boy said:
Sounds good.

If I try to set my memory above 5200, as things are, the system locks and I have to open the case and pull out the GPU to do a cmos reset.

Can you buy a cable with a button for that?

Maybe this will help?
Click to expand...

I think you're expecting a lot out of that (or any current platform) with 192GB of RAM.
 
LigTasm said:
I think you're expecting a lot out of that (or any current platform) with 192GB of RAM.
Click to expand...
Perhaps, though even with just 1 dimm, I tried all 4, its the same. So I think there is more going on. My guess is I got shorted on the silicone lottery and the memory controller is able to do at spec only. The cpu does only guarantee 5200 after all.
 
Elf_Boy said:
Perhaps, though even with just 1 dimm, I tried all 4, its the same. So I think there is more going on. My guess is I got shorted on the silicone lottery and the memory controller is able to do at spec only. The cpu does only guarantee 5200 after all.
Click to expand...

Uh huh, and did that single module happen to be a dual-rank 48GB Micron DIMM?
 
Elf_Boy said:
It did. I already know what your trying to say.
Click to expand...

It may be worth looking at the 9000 series, I've used a handful of them by now and they seem to have much stronger IMC capabilities than the 7000 series. My 9900X was able to run 6400 CL30 with 2200 fabric and only 1.100 vsoc.
 
LigTasm said:
It may be worth looking at the 9000 series, I've used a handful of them by now and they seem to have much stronger IMC capabilities than the 7000 series. My 9900X was able to run 6400 CL30 with 2200 fabric and only 1.100 vsoc.
Click to expand...

The Zen 5 memory controller is on the client I/O die (cIOD), which was brought over from Zen 4 unchanged. That's why it's still 6nm, still has a RDNA 2-based iGPU, and why USB4 had to be added via a separate 3rd party controller.
 
GotNoRice said:
The Zen 5 memory controller is on the client I/O die (cIOD), which was brought over from Zen 4 unchanged. That's why it's still 6nm, still has a RDNA 2-based iGPU, and why USB4 had to be added via a separate 3rd party controller.
Click to expand...

Same design does not mean no improvements. Alder lake and Raptor lake have the same design, and their capabilities are quite different.
 
LigTasm said:
Same design does not mean no improvements. Alder lake and Raptor lake have the same design, and their capabilities are quite different.
Click to expand...

It's not "the same design", The client I/O die is literally the same chiplet. There are no differences, changes, or improvements beyond AGESA updates (which would apply to Zen 4 also). If you have any evidence to suggest that there have been improvements, anywhere, please post that evidence here, as that would seem to contradict all currently known facts.

https://www.techpowerup.com/327388/amd-granite-ridge-zen-5-processor-annotated
Lastly, there's the client I/O die (cIOD). There's nothing new to report here, the chip is carried over from "Raphael." It is built on the TSMC N6 (6 nm) node. Nearly 1/3rd of the die-area is taken up by the iGPU and its allied components, such as the media acceleration engine, and display engine. The iGPU is based on the RDNA 2 graphics architecture, and has just one workgroup processor (WGP), for two compute units (CU), or 128 stream processors. Other key components on the cIOD are the 28-lane PCIe Gen 5 interface, the two IFoP ports for the CCDs, a fairly large SoC I/O consisting of USB 3.x and legacy connectivity, and the all important DDR5 memory controller with its dual-channel (four sub-channel) memory interface.
Click to expand...

https://www.anandtech.com/show/2146...bile-strix-point-with-rdna-35-igpu-xdna-2-npu
At Computex 2024, we confirmed that the Ryzen 9000 series actually uses the same I/O die as the Ryzen 7000 series, which was built using TSMC's 6 nm process. The only real difference between the Ryzen 9000 and Ryzen 7000 chips is that the Ryzen 9000 incorporates the latest Zen 5 cores in place of Zen 4 cores.
Click to expand...

https://www.guru3d.com/story/amd-ryzen-9000-die-shots-gets-annotated-in-detail/
he client I/O die in the Granite Ridge package remains unchanged from Raphael and is built using TSMC's N6 6-nanometer process. About one-third of the cIOD's die area is dedicated to the integrated GPU (iGPU) and related components, including the media acceleration engine and display engine. The iGPU is based on the RDNA 2 architecture and features a single Workgroup Processor (WGP) with two Compute Units (CU), totaling 128 stream processors.

Key features of the cIOD include a 28-lane PCIe Gen 5 interface, two IFoP ports for connecting the CCDs, extensive System on Chip (SoC) I/O capabilities such as USB 3.x and legacy connectivity, and a DDR5 memory controller. The memory controller supports a dual-channel configuration with four sub-channels, enhancing memory bandwidth and efficiency.
Click to expand...
 
GotNoRice said:
From your link:


Firmware, aka AGESA updates.
Click to expand...
Yeah well it also properly works with 4 DIMMs, so whatever firmware things they did it’s way the hell smoother than before.

Maybe how they are interfacing with that IO die is different not sure but it works much nicer with far fewer issues than previous generations.
 
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