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Following allegations that China spied on major US companies with micro-controllers embedded in PCBs, engineers from the University of Florida claim they were already working on the problem. Mark Tehranipoor, director of the Florida Institute for Cybersecurity Research, says their automated system "could have identified this part in a matter of seconds to minutes." Using "optical scans, microscopy, X-ray tomography, and artificial intelligence," the system compares PCBs to the original design specs, with very minimal human intervention. Tehranipoor claims they're working on completely automating the system, and postulates that the recent security scare might encourage manufacturers to adopt it.
It starts by taking high-resolution images of the front and back side of the circuit board, he explains. Machine learning and AI algorithms go through the images, tracing the interconnects and identifying the components. Then an X-ray tomography imager goes deeper, revealing interconnects and components buried within the circuit board. (According to Bloomberg, later versions of the attack involved burying the offending chip instead of having it sit on the surface.) That process takes a series of 2D images and automatically stitches them together to produce a layer-by-layer analysis that maps the interconnects and the chips and components they connect. The systems in question in the Bloomberg story probably had a dozen layers, Tehranipoor estimates. All this information is then compared to the original designs to determine if something has been added, subtracted, or altered by the manufacturer.
It starts by taking high-resolution images of the front and back side of the circuit board, he explains. Machine learning and AI algorithms go through the images, tracing the interconnects and identifying the components. Then an X-ray tomography imager goes deeper, revealing interconnects and components buried within the circuit board. (According to Bloomberg, later versions of the attack involved burying the offending chip instead of having it sit on the surface.) That process takes a series of 2D images and automatically stitches them together to produce a layer-by-layer analysis that maps the interconnects and the chips and components they connect. The systems in question in the Bloomberg story probably had a dozen layers, Tehranipoor estimates. All this information is then compared to the original designs to determine if something has been added, subtracted, or altered by the manufacturer.