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first build thermal paste

E

extrafuzzyllama

Limp Gawd
Joined
Jul 29, 2010
Messages
303
Hi all
I am on my first build and after searching how to apply thermal paste I have not found one way where its better then other.

Its either apply a small pea size paste in middle of CPU and put the heatsink on
or
Apply paste and spread it evenly

Which way is best?
 
I think both methods can work as long as they are done properly and/or it suits the type of TIM.

For the spreading evenly to work, you have to have a mega thin layer which is not so easy to accomplish.

I've switched to using a small pea sized in the middle and let the heatsink spread it out. I also apply a bit of TIM on the heatsink base and then clean it off, which leaves a very thin/microscopic layer which helps even more.
 
A drop that is between pea and rice in size on CPU is a sure tried and true method, and so easy too. You may be tempted to put more but trust me, the amount you need is really small and actually too much paste can be detrimental for heat transfer.
Press the heatsink down, twist it about 20 degrees and back and then secure the screws tightly. The pressure will spread the paste evenly filling microgaps and such effectively. Corners may be left without paste but it doesnt matter since the source of heat is in the center. Do not remove the heatsink once you have pressed down and twisted it to avoid airbubbles from forming, otherwise you may have to start from scratch.


Spreading method is the old way and some people swear by it claiming it gets better results than drop method. It however forms airbubbles quite easily. The layer has to be REALLY thin and even which is quite hard to make on some thermal pastes.

Third method is a cross method. You just draw a cross, corner to corner, from really thin lines of thermal paste, and then do the same stuff as with the drop method. This method is mandatory (this or spread one) for heatsinks with direct-touch heatpipes. The drop method wont work properly here as it will just squeeze itself between the heatpipes at the center, leaving the sides almost completely without paste.



To clean old paste away, use isopropyl alcohol
 
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I have had better results with using a thin layer over the entire heatspreader. It's not that hard using a credit card to smooth out an even layer. With the pea size method its easy IMO too lay down too much or too little. Too much acts as an insulator and too little makes the HSF less effective.

Do as you wish as people on both sides of the boat claim victory. If you notice high temps doing it one way, try the other out and from there form your own conclusion. The credit card method was the first and best IMO.

Have fun.
 
As BurntToast says - people have very different opinions on the subject.

I like the pea-method, since I'm not very keen on fiddling with the thermal paste to try to make an even layer. Whether is makes an actual difference temperature-wise, and cannot say, since I have always used this method. I have posted this video before, but will do so again. Have a look and judge for yourself:

http://www.youtube.com/watch?v=EyXLu1Ms-q4
 
personally i've done both methods (rice grain & spread) and i can't tell which is better.
there are a ton of variables to consider as well.

the thinner, less viscous TIM is better suited to the rice grain in the middle approach.
thicker, viscous TIM (like Arctic Silver 5) is better if spread.

when i applied AS5, i was pretty anal about it. i used a new razor blade to coat the surface. after done (this usually took a a few minutes to do), the layer was very thin and completely uniform.

now days i can't be arsed spreading thick TIM. i just use the thinner stuff. a rice or pea size drop, drop on the HS, rotate a few times and screw it down. done.

not a bad article on various methods;
http://++++++++++++++++.com/index.p...ask=view&id=170&Itemid=1&limit=1&limitstart=0
can't supply the link as [H] blocks it. search for 'Best Thermal Paste Application Methods' on the 'benchmark review' website

here is a massive review on 80 TIMs. its a little old now but the info is pretty good.
http://++++++++++++++++.com/index.php?option=com_content&task=view&id=150&Itemid=62
same site as above, [H] still blocks linkages. do a search for '80-way Thermal Interface Material Performance Test'. it's on the 'benchmark review' website
 
Thanks for the info guys I think I will go with pea size and pressing heatsink down.
I have arctic mx-4 is that a good choice?
 
as long as you're not using stuff this guy used (tho toothpaste worked quite well...tho chapstick and peanut butter were not recommended)
http://forums.overclockersclub.com/index.php?showtopic=164465

there is not a lot of difference between the modern TIMS (2 to 3C).

check the '80-way Thermal Interface Material Performance Test' and go to the last page for the summary of each brands performance. think MX-4 is in there somewhere.
 
For the longest time I used to spread it out thin but then i switched to the pea sized method and to me, it appears the pea size spreads out in a more even coverage and provides a better thermal transfer.
 
There's a third technique, which is the vertical or horizontal line which applies to some Intel processors. While the link may be from arctic silver it pretty much applies to most compounds, just do the technique that it suggests for the processor you have. http://www.arcticsilver.com/methods.html
 
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