I was looking at Intel's Spec Finder , and noticed that the SL6WK is a "Flip Chip " package, and the SL6WU is standard. Hmmm.... Has anyone else noticed this? I wonder which package is considered favorable. Anybody have any insights on this?
AFAIK, all s478 P4s are FC-PGA2, I think that 'FC-PGA2' has been omitted from the package type description on some of the processors. I don't think there has been any substantial changes in the P4 s478 packaging since it's introduction, apart from changes in cap/pad numbers and location, and the number of substrate layers.
Packaging doesn't affect processor performance but it may be beneficial for overclocking.
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