Delidding Haswell: Transistor question

C

c3k

2[H]4U
Joined
Sep 8, 2007
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Folks,

Just off to the side of the silicon die is a field of contacts, all under the heatshield. A lot of delidders recommend protecting them, in case the TIM you apply to the silicon migrates or simply just squishes out from the silicon. Obviously, you don't want to cover the contacts with conductor. (Or something with capacitive properties.)

What do you use to cover those contacts?

Thanks,
Ken
 
I've heard of people using this as well as a liquid electrical tape.
I would opt for either of these solutions before using nail polish.
 
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Those are all just basic clear acrylic lacquer, not much difference. Its pretty cheap so why not.
 
Great stuff, thanks! I -thought- I remembered nail polish, but I wasn't sure. For a couple bucks, something removable (I don't know why) seems better.

What about resealing the IHS? (I know to leave an air gap at one spot.) What type of product would be good?
 
c3k said:
Great stuff, thanks! I -thought- I remembered nail polish, but I wasn't sure. For a couple bucks, something removable (I don't know why) seems better.

What about resealing the IHS? (I know to leave an air gap at one spot.) What type of product would be good?
Click to expand...


Go bare die for best results with water cooling.


I'd leave the IHS un sealed if you want to use the IHS. When you delid you get rid of that glue space between the IHS and the PCB. The IHS will sit tighter on the DIE which is favorable. Just leave the IHS floating with CLP or CLI for TIM between die and IHS.
 
SonDa5 said:
Go bare die for best results with water cooling.


I'd leave the IHS un sealed if you want to use the IHS. When you delid you get rid of that glue space between the IHS and the PCB. The IHS will sit tighter on the DIE which is favorable. Just leave the IHS floating with CLP or CLI for TIM between die and IHS.
Click to expand...

The issue is if you remove the CPU later, the IHS will likely detach from the die with only CLP holding it in place at that point. Some say you will not be able to remove the Liquid Metal from the CPU die and underside of the IHS without lapping if it cures. Most people don't remove their CPU's every week to prevent it from hardening. I'm not sure how one would go about lapping the underside of the IHS? CPU die lapping seems bad as well but not sure what extent CLP will stick to the die.
 
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