DDR4 OEM memory overclocking

[ByReaL]

AFR, MFR, B-Die...
Some theory , price , ROI

so Hynix, Samsung,Micron ... make memory chips and they sell also their own memory sticks
example https://www.samsung.com/semiconductor/dram/module/M378A2K43BB1-CPB/
DDR4 2133CL15, can we get worst than that those days? but than they are making those for a while now on a mature process and manufacturing, so many of them are actually pretty good.

but than when we buy a G'Skill DDR4 3200CL16 all they do is to take same B-die AFR... ICs and bin them, and why buy a kit like that, usually if they find dies that do better they put them on higher spec/price kits, so you cannot overclock too much

on a 3200 KIT you cannot do +1000Mhz 4200Mhz but on a 2133 stick you may be able to do +1000Mhz = 3200

also the cost today the cheapest 16G DDR4 3000 CL16 is $100+
DDR4 2133 OEM sticks i can get for ~ $70

performance in day to day tasks + games past 3200 looks more like diminishing returns

so DDR4 32G KIT (2x16G) OEM 2133CL15-2400CL17 sticks for $140 and OC to 3200-3400
or Bined DDR4 32G KIT (2x16G) 3200CL16 for $240 and overclock to 3400 ? maybe

also read many posts about OEM sticks not OC to good and i'm not saying OEM sticks will go to 4000+ (mine never went past 3400 stable) but for cheapo OEM sticks +1000Mhz looks very good to me

also I read a lot about oh when you buy a kit they are tuned to work together.... i call a bit of BS on that

any opinion on why buy binned memory (except setting world record) versus just getting OEM sticks
when Dell, HP, fill gazillion workstations with 2 or 4 sticks of OEM memory that they probably buy in bulk, i dont think any tuning/pairing is being made.
now will both sticks OC same maybe not, but even in paired sticks they will work 3200 or whatever speed you buy but those have neither any warranty that they will OC equally
Don't get me wrong i see value in binning chips, enable XMP and you are goo to go...
for me is more of a thrill when i get a OEM 2133 stick and i push it to 3200 than when i get a 3200 binned one and spend same amount of time to get it stable at 3400.

soon i'll give it a try to even mix in some different brands to see if there is any downside to that (B-die OEM Samsung with Hynix MFR,i'll try to get some AFR and some Microns) all will be 16G dual rank, same number of ICs of same size, try to keep everything same except the OEM/IC manufacturer
i'll test each ram module individually to see what each can do, than insert them all and set the bios to the settings of the worst module

interested to hear opinions on DDR4 OEM sticks now in 2019 on a mature technology and process
yey on nay for overclocking

please post your stick part number and how far it went, reliably (1.35 to 1.5V since probably most people will not go over 1.5V for daily use, actually i see g'skill has kits with max 1.45V they discontinued the 1.5V kits)

 

[Aluminum]

Been doing this with Samsung ECC for awhile now on TR. FWIW Zen does NOT like anything but good samsung, you can get lucky on clocks but timings on hynix/micron/etc will be trash.

Overclock or know your data is not getting corrupted, fuck that, why not both?

The proper sticks to buy are (b-die):
M391A2K43BB1 DR: will do 2933 16-16-16 1.35V in 8x16GB - fully loaded IMC config, you might get more but mine are working 24/7 so stable or nothing
M391A1K43BB1 SR: will do 3200 14-14-14 1.35V in 4x8GB - plenty of ram for games etc

YMMV, probably easier on AM4 just divide stick count in half.

 

[ByReaL]

placed in my system some OEM b-die was able to boot them at 3600 but they were not stable (MFR was not able to boot at 3600)
https://www.samsung.com/semiconductor/dram/module/M378A2K43BB1-CPB/

i loaded 4 stick of memory 3 b-die and 1 MFR (see post above) set all 3200 they all seam to work fine (all are 16G dual rank), i'll post picture timings...
will try to see if i can find some other types of IC's in the memory pile, AFR , e-die should be decent too for 3200,

3200CL17 - all worked fine
3200CL16 - all worked fine
3200CL15 - 2 b-die sticks gave up under few hours of stability test

right now 2 MFR sticks and 1 b-die are going through overnight stability tests at CL15

 

[isekii]

placed in my system some OEM b-die was able to boot them at 3600 but they were not stable (MFR was not able to boot at 3600)
https://www.samsung.com/semiconductor/dram/module/M378A2K43BB1-CPB/

i loaded 4 stick of memory 3 b-die and 1 MFR (see post above) set all 3200 they all seam to work fine (all are 16G dual rank), i'll post picture timings...
will try to see if i can find some other types of IC's in the memory pile, AFR , e-die should be decent too for 3200,

3200CL17 - all worked fine
3200CL16 - all worked fine
3200CL15 - 2 b-die sticks gave up under few hours of stability test

right now 2 MFR sticks and 1 b-die are going through overnight stability tests at CL15

any update on the b-die sticks? is 3200CL15 the best you were able to get on it ?