Cooling Breakthrough for Computers, Car Electronics

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Researchers at Purdue University claim to have made a breakthrough in microchannel cooling technology that involves allowing liquid to boil inside the channels. Yes, I said “boil.” Speaking of hot, did you see that researcher chick?

Garimella and Harirchia have now determined that "allowing a liquid to boil in cooling systems dramatically increases how much heat can be removed, compared to simply heating a liquid to below its boiling point," according to their report.
 
That computer chip looks like a ceramic wall tile :eek:
and the chick is good looking (wonders about the angle)
 
Guh, they misspelled her name.

That being said I'm surprised that they haven't also developed a way to integrate car electronic cooling with engine cooling.
 
A scientific discovery at a prestigious university and you end your post with the term 'researcher chick'? Stay classy Steve.
 
This is 10 - 15 years from commercial viability and only on the higher end commercial/industrial scale. I hate these kind of press releases. Promises promises.
 
A scientific discovery at a prestigious university and you end your post with the term 'researcher chick'? Stay classy Steve.

Yep, I agree on the classiness ... and I'm not being sarcastic like you are. :p

Purdue_garimella_boiling_270x177.jpg


Lucky geek gets to work with her. :eek:
 
^ I dunno, but words like "Piston," "Cougar," and "Fuel Injection" comes to mind as well.
 
Not commenting specifically about this researcher chick's hottness or lack thereof.. that is in the eye on the beholder.. but.. GEEZ Steve.. you and a few posters need to get out a bit more.. a way bit more than you currently do since just a smiling lady contained within a 270x177 jpg sets your hormones fluttering!!

Here is a second opinion shot for you..

tharirch.JPG


Her bio - https://engineering.purdue.edu/CTRC/research/staff_bios/tharirch.php
 
What they have NOT done: "discovered" the phase-change effect used in heat pipes, fridges, etc.
What they HAVE done: accurately model the boiling of liquids in microchannels. It maybe that existing fibrous packing in heat pipes has been determined empirically to be the best structure, but with a proper hydrodynamic model their performance can probably be improved, along with the addition of heat pipe like structures into the chip packaging itself.
 
As a Purdue Alumni all I can say is, meh, she is about avg for the female student body.
 
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