Another idea I've had for awhile, please critique it. Hopefully this isn't a repeat.
Since condensation forms from water in the air at sub-zero temperatures, what if water was removed from the air in the case entirely?
The case would have to be sealed air tight, and would need two valves -- one at the top and one at the bottom. You replace the natural air in the case with another gas. The new gas would be inserted through the valve at the bottom (if the new gas were heavier than air), and the natural air would bleed out through the valve in the top. If the new gas were lighter than air, I assume this process would be reveresed. Once all of the air has been displaced and replaced with the new gas, the valves are closed.
What gasses could be used? Nitrogen?
I believe nitrogen is used to fill tires in race cars for the same purpose. Water in the natural air can change the tire pressure with varying weather and humidity.
If this solution were viable, the only other problem to tackle would be cooling the remaining components (assuming the cpu/gpu/chipset where cooled with either a sub-zero water cooling/phase/peltier solution).
Thoughts?
Since condensation forms from water in the air at sub-zero temperatures, what if water was removed from the air in the case entirely?
The case would have to be sealed air tight, and would need two valves -- one at the top and one at the bottom. You replace the natural air in the case with another gas. The new gas would be inserted through the valve at the bottom (if the new gas were heavier than air), and the natural air would bleed out through the valve in the top. If the new gas were lighter than air, I assume this process would be reveresed. Once all of the air has been displaced and replaced with the new gas, the valves are closed.
What gasses could be used? Nitrogen?
I believe nitrogen is used to fill tires in race cars for the same purpose. Water in the natural air can change the tire pressure with varying weather and humidity.
If this solution were viable, the only other problem to tackle would be cooling the remaining components (assuming the cpu/gpu/chipset where cooled with either a sub-zero water cooling/phase/peltier solution).
Thoughts?