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Soarin
2[H]4U
- Joined
- Jul 23, 2010
- Messages
- 2,489
Ok next issue, i just took my Stock HSF off and cleaned it well i reapplied the only thermal compound i had here. Ceramique by artic silver, and my temps ae the same XD. it was a bitch to apply very high density. I may be jumping the gun but really, 42c is high. i want to get low 30's or high 20's...
I just found this info So i guess the cure time is 100-300 hours... wtf... Would a hyper 212+ help me lower temps even after a cure or before because i like AS5 and if AS5 performs better i will buy a 212+ and AS5, this new sticky white stuff is new to me
Features:
High-Density ceramic content:
Céramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer in micro to moderate bond line situations. This exclusive combination provides performance exceeding most metal based compounds.
Controlled Triple-Phase Viscosity:
Céramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Céramique goes through are much more subtle and ultimately much more effective.)
Excellent Stability:
Céramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator:
Céramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Easy Clean Up:
Céramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions
Innovative Dispenser:
The 2.5-gram Céramique is the first product available in our proprietary thermal compound syringe. Our new syringe is more compact, easier to handle and dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.
EDIT:
I did just check and i guess i did something right because the temp is now 38-39
I just found this info So i guess the cure time is 100-300 hours... wtf... Would a hyper 212+ help me lower temps even after a cure or before because i like AS5 and if AS5 performs better i will buy a 212+ and AS5, this new sticky white stuff is new to me
Features:
High-Density ceramic content:
Céramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer in micro to moderate bond line situations. This exclusive combination provides performance exceeding most metal based compounds.
Controlled Triple-Phase Viscosity:
Céramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Céramique goes through are much more subtle and ultimately much more effective.)
Excellent Stability:
Céramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator:
Céramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Easy Clean Up:
Céramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions
Innovative Dispenser:
The 2.5-gram Céramique is the first product available in our proprietary thermal compound syringe. Our new syringe is more compact, easier to handle and dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.
EDIT:
I did just check and i guess i did something right because the temp is now 38-39
Last edited:
